Wafer Liquid Collection Height Control to Reduce Spray Scattering
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Solution Overview
Problem
In semiconductor manufacturing, the scattering of treatment liquids during the cleaning process leads to internal contamination of wafer treatment apparatuses and increases the likelihood of process errors.
Innovation Solution
A wafer treatment apparatus with a controller that adjusts the height of liquid collecting inlets relative to the wafer, being higher for backside liquid discharge than for frontside discharge, to reduce scattering and collection of treatment liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the liquid collecting inlet height is kept constant during wafer treatment, then the apparatus structure is simple, but treatment liquid scatters and causes internal contamination
Solution Approach 1:
The liquid collecting inlet height is changed from a fixed static structure to a dynamic adjustable structure. The controller modifies the inlet height based on the wafer treatment side being processed (frontside or backside), enabling the system to adapt to different operational conditions and prevent liquid scattering that would cause contamination.
Solution Approach 2:
The physical parameter of the liquid collecting inlet (its height position) is changed according to the treatment side. When treating the backside, the inlet is positioned higher to match the liquid discharge trajectory, while for frontside treatment, it is positioned lower, thereby optimizing liquid collection and preventing scattering.
2Object-affected harmful factors
If the liquid collecting inlet height is adjusted for optimal liquid collection, then scattering is reduced, but the control system becomes more complex
Solution Approach 1:
The height parameter of the liquid collecting inlet is dynamically adjusted based on the treatment side (frontside or backside) to optimize liquid collection. This parameter change ensures that the inlet is positioned at the appropriate height to intercept discharged liquid without scattering, while the controller automates this adjustment to minimize added complexity.
3Ease of manufacture
If a fixed liquid collecting inlet structure is used, then the apparatus is easier to manufacture, but process errors increase due to liquid scattering
Solution Approach 1:
The liquid collecting inlet structure transitions from a fixed manufactured component to a dynamically adjustable element. The controller enables the inlet height to be modified during operation based on the treatment side, maintaining ease of manufacture for the base structure while adding a simple actuation mechanism to improve reliability and reduce process errors.
Data Source
AI summary
A wafer treatment apparatus includes a wafer supporter for supporting and rotating a wafer, a frontside liquid discharger for discharging a liquid toward a frontside of the wafer, a backside liquid discharger for discharging the liquid toward a backside of the wafer, a treatment chamber for accommodating the wafer supporter, and including liquid collecting inlets stacked on each other and receiving the liquid discharged from at least one of the frontside and backside liquid dischargers, and a controller for controlling a height of an upper end of a first liquid collecting inlet of the liquid collecting inlets to have one of a first height in a process of discharging the liquid to the backside of the wafer adjacent to the wafer supporter and a second height, lower than the first height, in a process of discharging the liquid to the frontside of the wafer.