Load Lock Camera Layout for Wafer Position and Electrode Sagging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing inspection systems for film deposition processes on glass and wafers are unable to detect certain defects and cannot accurately recognize substrate location or process parameters within the deposition chamber.
Innovation Solution
A camera-based inspection system with multiple cameras positioned in the load lock unit of the deposition chamber, coupled with a control unit to analyze images for defects, substrate position, robot performance, and process parameters, including sagging electrodes and fixture alignment, using different reflectiveness and refractiveness of induced light for film analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If known vision systems are used for inspection, then basic defects like chipping and break can be detected, but other deposition process defects cannot be detected and substrate location and process parameters cannot be recognized
Solution Approach 1:
The inspection system is designed to perform multiple functions: detecting substrate defects (chipping, break, cracks), detecting deposition process defects (stains, spots, abnormal film formation), recognizing substrate location in the process chamber, and monitoring process parameters (electrode sagging, fixture alignment). This multi-functional capability resolves the contradiction by expanding inspection scope while maintaining reliable defect detection through a unified vision system with multiple cameras and comprehensive image analysis algorithms.
2Measurement precision
If multiple cameras are positioned in the load lock unit to capture substrate images, then comprehensive substrate and process monitoring is enabled, but system complexity increases
Solution Approach 1:
The inspection system divides the monitoring task into multiple segments by positioning different cameras at specific locations (first camera for substrate location, second camera for fixture alignment, third camera for electrode sagging). Each camera is assigned a specific inspection function, and the control unit processes images from each camera separately with specialized analysis algorithms. This segmentation approach enables comprehensive monitoring while managing system complexity through modular architecture.
3Reliability
If image analysis is used to detect defects and process parameters, then non-contact inspection is achieved, but analysis time and processing complexity increase
Solution Approach 1:
The system performs preliminary actions by capturing multiple images at different stages (before deposition, during deposition, after deposition) and pre-processing these images for specific analysis targets. The control unit is pre-programmed with analysis algorithms for different defect types and process parameters. This preliminary preparation reduces real-time processing time while maintaining high inspection accuracy through targeted analysis of pre-captured images.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively detects substrate breakage, cracks, stains, and robot performance issues, ensuring accurate substrate positioning and precise film deposition by analyzing corner film profiles and electrode flatness, thereby enhancing the reliability of the film deposition process.
Implementation Method 1
different reflectiveness and refractiveness of induced light for film analysis
Implementation Method 2
different reflectiveness and refractiveness of induced light for film analysis
Data Source
AI summary
A method of inspection and an inspection system for the film deposition process for substrates includes glass and wafer. The inspection system includes multiple camera modules positioned in a load lock unit of a process chamber, such as the camera modules that can capture images of the substrate in the load lock. The images are analyzed by a control unit of the inspection system to determine the accuracy of robots in handling the substrate, calibration of the robots based on the analysis, and defects in the substrate caused during the handling and deposition process.