Wafer Loader Alignment Mechanism for Reliable CMP Transfer
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Solution Overview
Problem
The transfer of wafers between different modules in CMP equipment is hindered by deviations between the robot arm and wafer loader, leading to difficulties in wafer pickup and potential damage.
Innovation Solution
A wafer polishing system with a wafer transfer device and polishing module, featuring a connection mechanism that allows the wafer loader to move in an X-Y plane, using a sliding rail and eccentric cam for precise alignment with clamping jaws, ensuring accurate wafer placement and pickup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a robot arm and wafer loader are used for transferring wafers between polishing units, then the polishing yield can be improved through multiple polishing units, but deviations between the robot arm and wafer loader cause difficulty in wafer pickup and potential damage
Solution Approach 1:
The wafer loader is designed with dynamic adjustment capabilities, allowing it to adapt its position and orientation in real-time. The connection mechanism includes movable components that can adjust the wafer loader's position in the X and Y directions, transforming a static structure into a dynamic one that compensates for alignment deviations during wafer transfer operations
Solution Approach 2:
The invention changes the positional parameters of the wafer loader by allowing it to move relative to the fixed base through the connection mechanism. This parameter adjustment enables the wafer loader to compensate for alignment errors and achieve proper positioning despite deviations in the robot arm or wafer loader trajectories
2Ease of operation
If the robot arm moves from station a to b and the wafer loader moves from station c to d, then wafer transfer between polishing units is achieved, but the lines are not completely parallel causing deviation and pickup difficulty
Solution Approach 1:
The connection mechanism acts as an intermediary between the fixed base and the wafer loader. This intermediate structure provides the necessary flexibility and adjustment capability to bridge the alignment gap caused by non-parallel movement lines, allowing the wafer loader to achieve proper positioning despite the geometric constraints of the transfer path
Solution Approach 2:
The connection mechanism enables dynamic positioning of the wafer loader, allowing it to adjust its position in real-time to compensate for the non-parallel movement lines. This dynamic adjustment ensures that even though the robot arm and wafer loader follow different paths, the wafer loader can still achieve accurate alignment for wafer pickup
Data Source
AI summary
To the Abstract:The invention discloses a wafer polishing system, comprising a wafer transfer device comprises a fixed base and a wafer loader for carrying a wafer, and the fixed base being able to drive the wafer loader to move in a wafer transfer channel in an X-axis direction; and a polishing module, being arranged on one side of the wafer transfer channel and being able to pick up the wafer from the wafer loader to polish the wafer; wherein, a connection mechanism is arranged between the fixed base and the wafer loader, and the connection mechanism has a portion connected to the fixed base and a portion connected to the wafer loader. The invention further discloses a loading method for the wafer polishing system and a using method for the wafer polishing system.