Semiconductor Wafer Handling with Localized Thermal Control
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Solution Overview
Problem
Existing semiconductor wafer testing systems face challenges in quickly adjusting the temperature of Device Under Test (DUT) due to the difficulty in localized heat management across the entire wafer surface.
Innovation Solution
A semiconductor wafer handling apparatus that includes a holder to expose both surfaces of the wafer, a temperature adjusting device that contacts the second surface to independently adjust the temperature of DUTs, and moving devices to precisely position these components relative to a probe card.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature adjusting means is disposed in the wafer chuck to adjust the temperature of the entire semiconductor wafer, then the temperature control covers the whole wafer surface, but the temperature adjustment speed is slow and cannot respond quickly to heat generated by the semiconductor device
Solution Approach 1:
The patent divides the temperature control system into multiple independent temperature adjusting means (first, second, third temperature adjusting means) positioned at different locations. Each means can independently adjust the temperature of its local area, enabling faster response to heat generation while maintaining overall wafer temperature control. This segmentation resolves the contradiction by allowing localized rapid adjustment without sacrificing comprehensive coverage.
Solution Approach 2:
The patent implements local quality by positioning temperature adjusting means at specific locations where heat generation is most likely to occur. The first temperature adjusting means is positioned near the semiconductor device, the second near the probe card, and the third near the wafer chuck. This localized approach enables rapid temperature adjustment in critical areas while maintaining overall temperature control across the wafer surface.
2Temperature
If a single temperature adjusting means controls the entire wafer, then the structure is simple, but the temperature uniformity across different regions cannot be maintained
Solution Approach 1:
The patent segments the temperature control function into multiple independent temperature adjusting means, each responsible for a specific region. This allows independent control of temperature in different areas, maintaining temperature uniformity across the wafer while avoiding the need for a single complex centralized control system.
Solution Approach 2:
Each temperature adjusting means is designed to perform multiple functions: local heating or cooling, temperature sensing, and adaptive control. This multi-functionality allows the system to maintain temperature uniformity across different regions while keeping each individual component relatively simple, thus resolving the contradiction between temperature uniformity and system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables faster and more precise temperature adjustment of DUTs, improving the efficiency of semiconductor wafer testing by allowing for localized temperature control.
Implementation Method 1
a temperature adjusting device that contacts the second surface of the semiconductor wafer and adjusts a temperature of the DUTs
Data Source
AI summary
A semiconductor wafer handling apparatus moves a semiconductor wafer including a first surface on which a terminal of one or more device under tests (DUTs) is disposed and presses the terminal against a contactor of a probe card. The semiconductor wafer handling apparatus includes: a holder that holds the semiconductor wafer such that the first surface and a second surface of the semiconductor wafer are at least partially exposed; a first moving device that relatively moves the holder with respect to the probe card; a temperature adjusting device that contacts the second surface of the semiconductor wafer and adjusts a temperature of the DUTs; and a second moving device that relatively moves the temperature adjusting device with respect to the semiconductor wafer held by the holder.