Wafer Locking Mechanism for Precise Positioning and Static Control
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Solution Overview
Problem
In semiconductor manufacturing, wafer positioning precision is critical for accurate detection, but existing systems face challenges with positioning errors and electrostatic discharge during wafer handling, leading to inefficiencies in electron beam detection processes.
Innovation Solution
A wafer locking mechanism with a frustum-shaped base and radially adjustable rods, combined with an electrostatic chuck and ionic wind system, ensures precise wafer positioning and neutralizes static electricity, facilitating reliable transfer and detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If a robot arm is used to transfer wafer, then wafer transfer automation is achieved, but positioning errors accumulate leading to inaccurate wafer placement
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the robot arm and the wafer stage. The positioning pin physically guides and corrects the wafer position, serving as a mediator that compensates for robot arm positioning errors and ensures accurate wafer placement on the stage.
2Productivity
If the field of view of optical microscope is reduced to increase yield and throughput, then detection efficiency is improved, but wafer positioning precision requirement increases
Solution Approach 1:
The wafer is pre-positioned and locked onto the stage before the detection process begins. This preliminary positioning action ensures that the wafer is accurately located in advance, allowing the system to use a smaller field of view for high-speed detection without compromising positioning accuracy during the actual detection process.
3Reliability
If conventional wafer locking mechanism is used, then wafer is secured to stage, but electrostatic discharge occurs during wafer handling
Solution Approach 1:
The positioning pin, which is in continuous contact with the wafer during positioning and locking, serves a dual function: it mechanically secures the wafer to the stage while simultaneously acting as an electrostatic discharge path. The pin conducts away accumulated electrostatic charges from the wafer, converting the potential harmful electrostatic discharge into a protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism provides secure wafer locking and positioning, reducing positioning errors and electrostatic discharge, enhancing the efficiency and reliability of electron beam detection processes.
Implementation Method 1
a plurality of compression springs, which are respectively sheathed on respective distal ends of the plurality of rods distal to the wafer base, in one-to-one correspondence and extend radially outwards. The plurality of rods are respectively provided with both a plurality of ball-head portions which are located at respective proximal ends thereof proximate to the wafer base and abut against the wafer base, in one-to-one correspondence, and a plurality of jaws which protrude from the respective distal ends along a direction of the axis on a single side of the top portion and are pressed radially inwards by the plurality of compression springs
Implementation Method 2
combined with an electrostatic chuck and ionic wind system, ensures precise wafer positioning and neutralizes static electricity
Data Source
AI summary
Provided is a wafer locking mechanism configured to lock a wafer, the wafer locking mechanism comprising: a wafer base, constructed in a form of a frustum shape tapering from a bottom portion thereof towards a top portion thereof, and configured to be elevatable along a direction of an axis thereof; a plurality of rods, which are diametrically aligned in pairs perpendicular to the axis; and a plurality of compression springs, which are respectively sheathed on respective distal ends of the plurality of rods distal to the wafer base, in one-to-one correspondence and extend radially outwards. Each of the rods is provided with a ball-head portion which is located at a proximal end thereof proximate to the wafer base and abuts against the wafer base, and a jaw which is pressed radially inwards by the corresponding compression spring.