Wafer Machining Setup Using In-Transfer Pattern Recording
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Solution Overview
Problem
The existing machining systems require significant labor and time to set up new machining conditions for unprocessed wafers, involving repeated loading and unloading of wafers for imaging and pattern recording, which hinders efficient machining of new types of wafers.
Innovation Solution
A management method for machining systems that automates the recording of patterns and machining conditions by using a camera unit to image the wafer, record the pattern, and associate it with new machining conditions, allowing the system to start the automatic machining program without returning the wafer to the cassette, thus streamlining the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If the wafer is unloaded from the cassette for imaging before starting the automatic machining program, then the pattern can be recorded and associated with machining conditions, but the setup time and labor increase significantly due to repeated loading and unloading
Solution Approach 1:
The system performs pattern imaging and machining condition recording as preliminary actions during the wafer transfer process before machining begins. The control unit automatically images the wafer pattern, records it, and associates it with machining conditions without requiring separate manual setup steps, thus preparing everything in advance for immediate machining startup
Solution Approach 2:
The patent merges the pattern recording function with the automatic machining program startup process. Instead of separate operations (unload for imaging, then reload, then start machining), the system combines these into a single automated sequence where imaging occurs during transfer, and machining starts immediately afterward without intermediate manual intervention
2Ease of operation
If the operator manually commands the start of the automatic machining program after recording conditions, then machining can begin, but the labor and time required for setup increase
Solution Approach 1:
The system performs self-service by automatically executing the machining startup sequence after pattern recording. The control unit autonomously initiates the automatic machining program without requiring manual operator intervention to command the start, thereby reducing both labor and setup time while maintaining operational control
3Extent of automation
If the wafer is imaged by the camera unit during the transfer process, then automated pattern recording is achieved without additional loading/unloading steps, but the system complexity increases
Solution Approach 1:
The camera unit and control unit are designed with multi-functionality, serving both as imaging devices for pattern recognition and as control centers for orchestrating the automated machining sequence. This universal design allows the same components to perform multiple functions (imaging, recording, associating data, and triggering machining) without adding separate dedicated systems, thereby managing complexity while achieving high automation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables prompt and automated machining of new types of wafers by integrating pattern recording and machining condition association directly within the machining process, reducing labor and time required for setup and ensuring efficient processing.
Implementation Method 1
a camera unit that images the wafer to acquire an image containing a pattern formed on a side of the front surface of the wafer
Data Source
AI summary
A management method of a machining system includes a chuck table, a machining unit, a transfer unit that transfers a wafer onto the chuck table, a camera unit that acquires an image containing a pattern formed on a side of a front surface of the wafer, and an information recording section. The management method is applied when the pattern is recorded in association with machining conditions in the information recording section; and records in the information recording section new machining conditions to be used when machining a new type of wafer, causes an automatic machining program, which automatically machines the new type of wafer, to start, forms an image, which contains a new pattern of the new type of wafer, by the camera unit, and records the new pattern in association with the new machining conditions in the information recording section.