Wafer Map Correlation Analysis for Exposure Parameter Feedback
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Solution Overview
Problem
In semiconductor manufacturing, existing systems face challenges in efficiently analyzing and improving wafer quality due to variations in light emission from laser apparatuses, which affect exposure performance and final wafer quality, as data analysis on a wafer basis is not sufficiently analyzed across multiple apparatuses.
Innovation Solution
A data analyzer system that collects data from multiple apparatuses, including laser, exposure, and wafer inspection systems, converts this data into images, and performs pattern matching to determine correlation values between parameters, allowing for parameter feedback control to improve wafer quality and manufacturing precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If data from multiple apparatuses is collected and analyzed on a wafer basis, then manufacturing precision and wafer quality improve, but device complexity and data processing requirements increase
Solution Approach 1:
The data analysis system is segmented into multiple functional modules: a data collection module that gathers parameters from laser apparatus, exposure apparatus, and wafer inspection apparatus; a data processing module that performs pattern matching and correlation analysis; and a feedback control module that adjusts manufacturing parameters. This segmentation allows complex data analysis to be broken down into manageable steps, improving manufacturing precision without overwhelming system complexity.
Solution Approach 2:
The system implements feedback control by comparing inspection results with target values and automatically adjusting manufacturing parameters. The data collection module gathers parameters from multiple apparatuses, the analysis module identifies correlations, and the feedback control module modifies laser or exposure parameters to improve wafer quality. This closed-loop feedback mechanism continuously improves manufacturing precision while keeping the system structure organized and manageable.
2Measurement precision
If correlation analysis is performed on multiple parameters across different apparatuses, then parameter control accuracy improves, but data processing time and computational load increase
Solution Approach 1:
The system performs preliminary data processing by collecting and organizing parameters from multiple apparatuses before conducting correlation analysis. The data collection module pre-processes raw data into standardized formats, and the analysis module pre-identifies potentially correlated parameter pairs based on physical relationships in the manufacturing process. This preliminary action reduces the computational load during actual correlation analysis, improving measurement precision while minimizing data processing time.
3Manufacturing precision
If line narrowing module is added to laser resonator to narrow spectral linewidth, then chromatic aberrations are reduced and resolution improves, but device complexity and manufacturing cost increase
Solution Approach 1:
Instead of adding a line narrowing module to the laser resonator, the system achieves narrow spectral linewidth by changing the resonator configuration parameters - specifically by using a stable resonator design with appropriate mirror curvatures and spacing. This parameter change approach narrows the spectral linewidth to reduce chromatic aberrations in the projection lens, improving manufacturing precision without adding the complexity of a line narrowing module.
Data Source
AI summary
A data analyzer includes a data collector that acquires data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus that exposes a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus that inspects the exposed wafer, an image generator that visualizes the data on each of the parameters collected by the data collector from the apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generates a plurality of mapped images for each of the parameters of the apparatuses, and a correlation computing section that performs pattern matching on arbitrary ones of the mapped images generated from the wafer to determine a correlation value between arbitrary ones of the parameters of the apparatuses.