Inspection Wafer Map Alignment for Accurate Valid Die Positions

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Solution Overview

Problem

Manual selection of valid die positions on a wafer map is time-consuming and prone to errors, especially when distinguishing between valid, invalid, and test dies, which affects the accuracy and efficiency of wafer quality measurements.

Innovation Solution

A method using a computer program to calculate and automatically define valid die positions on an inspection wafer map by obtaining a reference die position, calculating coordinates, and modifying the map to generate a correct valid die map, eliminating the need for manual selection and reducing errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual selection of valid die positions is performed, then flexibility and adaptability are maintained, but time consumption and error rate increase significantly

Engineering Contradiction:

Improveaccuracy of valid die position definitionVSAvoidtime for manual selection and inspection

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces the manual mechanical selection process with an automated computer-based system that uses coordinate calculations and data processing to automatically identify and define valid die positions on wafer maps, eliminating manual labor while maintaining or improving accuracy

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates and uses map center data as a digital copy/reference of the wafer map structure, allowing automated coordinate-based identification of valid die positions without needing manual inspection of each die location

Inventive Principle:

Principle #26Copying

2Measurement precision

If manual inspection of all valid dies is performed, then comprehensive quality assessment is possible, but mistakes and inaccuracies occur

Engineering Contradiction:

Improveaccuracy of wafer quality measurementVSAvoidconsistency of manual inspection results

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent replaces manual inspection with automated computer-based processing that uses precise coordinate calculations to identify valid die positions, eliminating human errors and inconsistencies while maintaining measurement precision through systematic data processing

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If automated methods are used to define valid die positions, then time efficiency and accuracy improve, but system complexity increases

Engineering Contradiction:

Improvespeed of valid die position definitionVSAvoidcomplexity of automated positioning system

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent creates a universal automated system that can process different wafer maps using a standardized coordinate calculation approach, making the system adaptable to various inspection scenarios without requiring complex customization for each case

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses map center data as an intermediary element that bridges the wafer map and the coordinate system, simplifying the automated identification process by providing a reference framework for calculating valid die positions

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12555265B2Method for defining valid die positions on inspection wafer map

Publication Date: 2026.02.17 UNITED MICROELECTRONICS CORP

AI summary

A method for defining valid die positions on an inspection wafer map includes the following steps. A position of a reference die in an inspection wafer map is obtained, and the position of the reference die is adjacent to a center point of the inspection wafer map. A map center data is obtained, and the coordinates of the reference die in the map center data is calculated. A relative offset between the coordinate system of the inspection wafer map and the coordinate system of the map center data is calculated according to the coordinates of the reference die in the map center data. The valid die positions of the map center data are returned to the inspection wafer map and the inspection wafer map is modified to generate a correct valid die map.