Wafer Map-Based Die Mounting with Passive Component Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing component mounting process is labor-intensive and costly due to the need for manual ranking and taping of dies with varying electrical characteristics, which requires peeling each die from a dicing sheet and housing them in component supply tapes, increasing operational time and die prices.
Innovation Solution
A component mounting system that uses a die supply device and multiple feeders to automatically select and mount passive components with optimal characteristics to absorb variance in die characteristics, eliminating the need for manual ranking and taping by referencing wafer map data and passive component combination data to sequentially supply and combine dies and passive components on a circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a universal mounting head is used for all component types, then device complexity is reduced, but mounting precision deteriorates for LGA components
Solution Approach 1:
The mounting head is segmented into a universal base structure and interchangeable component-specific attachments. Each attachment (e.g., pin gripper for PGA, clamp for QFP, pad for LGA) is a separate module that can be quickly exchanged based on component type, maintaining both device simplicity and mounting precision.
Solution Approach 2:
The mounting head design achieves universality through a standardized interface that accommodates multiple component types. The base mounting head provides common functions (positioning, heating, z-axis control) while interchangeable attachments provide type-specific functions, allowing one base unit to serve multiple purposes.
2Manufacturing precision
If separate mounting heads are used for different component types, then mounting precision is improved, but device complexity increases
Solution Approach 1:
The mounting head system transitions from static dedicated heads to a dynamic interchangeable attachment system. The ability to quickly swap attachments allows the system to adapt its configuration based on the component being mounted, providing precision-specific capabilities without permanently increasing device complexity.
Solution Approach 2:
An intermediary attachment interface is introduced between the universal mounting head base and the various component types. This intermediary layer (the interchangeable attachment) mediates between the common mounting functions and the specific requirements of different component types, enabling precision mounting without requiring multiple complete mounting head systems.
3Adaptability or versatility
If mounting head is frequently exchanged for different component types, then adaptability is improved, but mounting time increases
Solution Approach 1:
Multiple attachments for different component types are prepared in advance and kept readily available. The standardized interface allows pre-prepared attachments to be quickly installed without complex adjustment or calibration, reducing the time penalty associated with exchanging mounting heads for different component types.
Solution Approach 2:
The attachment exchange mechanism is designed to be dynamic and quick, allowing rapid switching between different component types. The standardized interface enables fast connection and disconnection without requiring time-consuming alignment or securing operations, thus maintaining adaptability while minimizing time loss.
4Device complexity
If conventional mounting methods are used for LGA components, then device complexity is maintained, but mounting precision and reliability deteriorate
Solution Approach 1:
The pad attachment for LGA components provides localized quality specifically tailored to LGA requirements. It features a flat mounting surface with precise positioning features and integrated heating elements positioned exactly where needed for LGA components, achieving high mounting precision without complicating the overall mounting system structure.
Solution Approach 2:
The pad attachment serves as an intermediary between the conventional mounting head and the LGA component. It translates the generic mounting functions into LGA-specific precision mounting through its specialized design (flat surface, positioning features, heating), allowing conventional mounting systems to achieve LGA-level precision without fundamental structural changes.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A die supply device that supplies dies and multiple feeders that supply a passive component to be combined with the die are both loaded on a component mounter. Wafer map data to which a ranking of a characteristic of each die on a wafer is added, and passive component combination data that specifies a combination passive component with the optimum characteristic for each rank of die from multiple passive components with a different characteristic, are created. The multiple feeders supply the multiple passive components with a different characteristic to the component mounter; the die supply device supplies each die of the wafer to the component mounter in the order in which the dies are arranged on the wafer; the component mounter mounts the passive component to be combined with the die supplied from the die supply device on the circuit board by selecting the passive component from the multiple passive components with a different characteristic based on the wafer map data and the passive component combination data. Thus, variance in a characteristic of the dies is absorbed.