Automated In-Line Process Control Guidance for Semiconductor Wafer Marginalities
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Solution Overview
Problem
Current methods for guiding in-line process control of semiconductor wafers are slow, impractical, and lack automation, failing to comprehensively utilize design team knowledge for inspection, review, and metrology, leading to inefficient defect detection and process control.
Innovation Solution
A computer-implemented method and system that automatically identifies potential design marginalities and generates information for setting up process control, using computer subsystems to query design databases and modify physical design elements for targeted inspection and metrology, enabling comprehensive and automated guidance for in-line inspection, review, and metrology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If manual methods are used to generate design guidance for process control, then comprehensive coverage of design team knowledge can be achieved, but the process becomes slow and impractical
Solution Approach 1:
The system enables automatic self-generation of design guidance by querying design databases and autonomously identifying marginalities, eliminating the need for manual intervention while maintaining comprehensive knowledge coverage
Solution Approach 2:
Manual mechanical processes of reviewing design data are replaced with automated computer-based systems that query databases and generate guidance, dramatically reducing time while preserving information completeness
2Loss of information
If comprehensive design guidance is generated manually, then complete utilization of design team knowledge is achieved, but automation is substantially lacking
Solution Approach 1:
The system performs automatic querying of design databases, autonomous identification of marginalities, and self-generation of guidance information, achieving both comprehensive knowledge utilization and full automation
Solution Approach 2:
Manual design review processes are replaced with automated computer-based systems that interface with design databases, eliminating manual labor while maintaining complete knowledge utilization
3Measurement precision
If detailed design analysis is performed, then comprehensive identification of potential marginalities is achieved, but the process becomes slow and impractical
Solution Approach 1:
The system automatically performs detailed design analysis by querying databases and identifying marginalities without manual intervention, achieving both high precision and fast processing
Solution Approach 2:
Manual detailed analysis processes are replaced with automated computer-based systems that rapidly query design databases and identify marginalities with high accuracy
Data Source
AI summary
Methods and systems for extracting comprehensive design guidance for in-line process control of wafers are provided. One method includes automatically identifying potential marginalities in a design for a device to be formed on a wafer. The method also includes automatically generating information for the potential marginalities. The automatically generated information is used to set up process control for the wafer.

