Auto Dicing Recipe Generation From Wafer Mark Pattern Recognition
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Solution Overview
Problem
The increasing complexity of integrated circuit packages requires more efficient and automated methods for dicing wafers, as conventional processes involve redundant steps and manual alignment, leading to reduced throughput and accuracy.
Innovation Solution
An automated wafer dicing system that uses a database to store and retrieve dicing recipes, featuring a CCD camera system for pattern recognition and alignment, allowing for automatic measurement and dicing of wafers by determining kerf centers and die pitches, thereby eliminating redundant operations and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manual dicing process is used, then alignment and dicing can be performed, but redundant steps and manual intervention reduce throughput and accuracy
Solution Approach 1:
The system enables self-service automation by having the dicing apparatus automatically perform alignment and dicing operations without manual intervention. The controller autonomously controls the alignment mechanism and dicing blade based on stored recipe parameters, eliminating the need for operators to manually align wafers and perform dicing operations.
Solution Approach 2:
The system implements preliminary action by pre-storing dicing recipes containing all necessary parameters (blade speed, depth, feed rate, acceleration, deceleration) before the actual dicing process. This allows the system to automatically execute the complete dicing sequence without real-time manual input, improving throughput while maintaining precision.
2Measurement precision
If automated dicing system is implemented, then throughput and accuracy are improved, but device complexity increases
Solution Approach 1:
The dicing apparatus integrates multiple functions into a single automated system: wafer loading, alignment based on scribe lines, blade control, and dicing execution. This multi-functionality reduces the need for separate manual operations while improving measurement precision through integrated sensors and controllers that monitor position and depth in real-time.
Solution Approach 2:
The system incorporates feedback mechanisms where the controller continuously monitors the dicing process parameters (blade position, depth, speed) and adjusts them based on pre-stored recipe data. This closed-loop control ensures high alignment accuracy while managing system complexity through automated parameter optimization.
3Loss of time
If dicing parameters are manually set for each wafer, then flexibility is maintained, but time consumption increases
Solution Approach 1:
The system uses copying by storing complete dicing recipes (containing all parameters for blade speed, depth, feed rate, acceleration, deceleration) in a database for reuse. Instead of manually setting parameters for each wafer, the system retrieves and executes pre-configured recipes, dramatically reducing setup time while maintaining the ability to adapt to different wafer types through recipe selection.
Solution Approach 2:
The system manages parameter changes by storing multiple dicing recipes with different parameter sets for various wafer types and dicing requirements. The controller automatically selects and applies the appropriate recipe based on the wafer being processed, enabling rapid parameter adjustment without manual reconfiguration and maintaining versatility across different dicing scenarios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system significantly improves throughput and accuracy by automating the dicing process, reducing manual intervention and redundant steps, and enabling precise alignment and measurement of wafers using stored patterns and illumination values.
Implementation Method 1
a CCD camera system for pattern recognition and alignment, allowing for automatic measurement and dicing of wafers by determining kerf centers and die pitches
Data Source
AI summary
A method includes forming a database, finding a plurality of dicing marks on a wafer, wherein patterns of the plurality of dicing marks match a pattern in the database, measuring a die pitch of the wafer according to a patch of adjacent two of the plurality of dicing marks, and determining kerf centers of the wafer based on the plurality of dicing marks. The measuring the die pitch and the determining the kerf centers are performed on a same wafer-holding platform. The wafer is diced into a plurality of dies, and the dicing is performed aligning to the kerf centers.