Wafer-to-Mask Alignment Marks for High-Resolution Display Overlay
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Solution Overview
Problem
Current alignment technologies for high-resolution light emitting display panels, particularly in Head Mounted Display Devices, face challenges in accurately aligning wafers and masks due to the complexity of their structures and the need for precise positioning.
Innovation Solution
An alignment apparatus and method utilizing a support substrate with specific alignment marks on a glass substrate, a camera, and a controller to align the wafer and mask by overlapping and positioning these marks within defined ranges, ensuring accurate alignment for subsequent processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used for high-resolution light emitting display panels, then the manufacturing process can proceed, but the alignment precision between wafer and mask is insufficient due to structural complexity
Solution Approach 1:
The alignment mark is segmented into multiple distinct components: a first alignment mark on the glass substrate, a second alignment mark on the wafer, and a third alignment mark on the mask. Each mark serves a specific alignment function, allowing independent positioning and alignment verification. This segmentation enables precise alignment by separately controlling the position of each component rather than attempting to align complex structures as a whole.
Solution Approach 2:
The first alignment mark on the glass substrate serves as an intermediary reference that mediates the alignment between the second alignment mark on the wafer and the third alignment mark on the mask. By establishing a common reference frame through this intermediary mark, the patent enables accurate relative positioning between the wafer and mask despite their structural complexity.
2Manufacturing precision
If alignment marks are added to facilitate precise positioning, then alignment accuracy improves, but the device structure becomes more complex
Solution Approach 1:
The first alignment mark on the glass substrate serves multiple functions: it acts as a reference for positioning the wafer, a reference for positioning the mask, and a common coordinate system for both alignment operations. This multi-functionality reduces the need for separate alignment references for each component, thereby improving positioning accuracy without proportionally increasing structural complexity.
3Device complexity
If the alignment mark structure is simplified, then device complexity reduces, but alignment precision deteriorates
Solution Approach 1:
The alignment system utilizes dimensional relationships between marks positioned at different locations and orientations. The first alignment mark extends in a first direction, while the second and third alignment marks extend in a second direction intersecting the first. This dimensional arrangement creates a robust reference framework that achieves high alignment precision through geometric relationships rather than through complex mark designs.
Data Source
AI summary
An alignment apparatus includes a support substrate having a first alignment mark formed thereon, and a wafer mounted on the support substrate as aligned to the first alignment mark. The first alignment mark includes a first mark extending in a first direction, a second mark extending in a second direction and intersecting the first mark at a side of the first mark, and a third mark extending in the second direction and intersecting the first mark at another side of the first mark.