Wafer Deposition Mask with Localized Deformation-Resistance Layers

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Solution Overview

Problem

Existing deposition masks for organic light emitting display devices face challenges in providing adequate deformation resistance and alignment accuracy during the deposition of organic light emitting layers, leading to potential shadowing and misalignment issues.

Innovation Solution

A deposition mask comprising a wafer substrate with deformation resistance layers and an inorganic layer, featuring specific opening patterns and alignment grooves, which includes materials with low thermal expansion and high Young's modulus, such as graphene, to enhance deformation resistance and alignment precision.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional deposition mask is used, then the structure is simple, but deformation resistance and alignment accuracy are insufficient

Engineering Contradiction:

Improvedeformation resistanceVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies composite materials by combining the wafer substrate with deformation resistance layers made of materials having specific properties (thermal expansion coefficient ≤10 in/in°C and Young's modulus ≥300 GPa). This composite structure provides enhanced deformation resistance while maintaining manufacturing feasibility through established deposition processes.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The deposition mask is segmented into multiple functional layers: the wafer substrate, deformation resistance layers positioned at specific locations, and inorganic layers. This segmentation allows each layer to perform its specific function optimally while collectively solving the deformation and alignment issues.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If a conventional deposition mask is used, then the manufacturing process is simple, but alignment accuracy and shadowing prevention are insufficient

Engineering Contradiction:

Improvealignment accuracyVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The deformation resistance layers are formed in advance on the wafer substrate before the inorganic layers are deposited. This preliminary action ensures that the mask structure is pre-prepared to maintain alignment accuracy throughout the subsequent deposition process, preventing shadowing issues before they occur.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The deformation resistance layers are strategically positioned only in specific areas where alignment precision is critical, rather than uniformly across the entire mask. This local application optimizes alignment accuracy where needed while simplifying the overall manufacturing process.

Inventive Principle:

Principle #3Local quality

3Strength

If the deposition mask structure is simplified, then manufacturing is easier, but deformation resistance during organic light emitting layer deposition is insufficient

Engineering Contradiction:

Improvedeformation resistanceVSAvoidlayer structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent specifies precise parameter ranges for the deformation resistance layer materials: thermal expansion coefficient ≤10 in/in°C and Young's modulus ≥300 GPa. By controlling these parameters, the mask achieves enhanced deformation resistance through material selection rather than structural complexity.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved deformation resistance and alignment accuracy, preventing shadowing and misalignment during the deposition process, thereby enhancing the reliability and efficiency of organic light emitting layer deposition.

Implementation Method 1

a plurality of deformation resistance layers disposed on the wafer substrate to overlap the plurality of cell opening areas in a plan view and corresponding one-to-one to the plurality of cell opening areas

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

Methodology Applied

Scientific EffectYoung's modulus:

Data Source

PatentUS20250297357A1Deposition mask and method of manufacturing the same

Publication Date: 2025.09.25 SAMSUNG DISPLAY CO LTD

AI summary

A deposition mask includes a wafer substrate including a first portion, a second portion below the first portion, and a plurality of cell opening areas spaced apart from each other, a plurality of deformation resistance layers disposed on the wafer substrate to overlap the plurality of cell opening areas in a plan view and corresponding one-to-one to the plurality of cell opening areas, and an inorganic layer disposed on the wafer substrate to cover the wafer substrate and the plurality of deformation resistance layers. In each of the plurality of cell opening areas, a plurality of first opening patterns penetrating the first portion, a corresponding one of the plurality of deformation resistance layers, and the inorganic layer in a thickness direction are defined, and a plurality of second opening patterns overlapping the plurality of cell opening areas in a plan view and penetrating the second portion in the thickness direction are defined.