Semiconductor Wafer Mass Metrology With Thermal Equalization
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Solution Overview
Problem
Existing semiconductor wafer mass metrology systems face challenges in achieving high accuracy due to temperature variations between the semiconductor wafer and the measurement apparatus, leading to errors in mass measurements.
Innovation Solution
The system measures the temperature of a temperature changing part or the semiconductor wafer before it is transported into a measurement chamber, allowing for improved temperature control and reduced measurement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If mass measurement is performed on semiconductor wafers with temperature variations, then measurement speed is maintained, but measurement precision deteriorates due to temperature-related errors
Solution Approach 1:
The system performs preliminary temperature equalization by placing the semiconductor wafer on a thermal transfer plate before measurement. The plate pre-cools or pre-heats the wafer to match the measurement chamber temperature, eliminating temperature differences before the actual mass measurement occurs. This preliminary action prevents temperature-related errors without requiring complex real-time temperature control during measurement.
Solution Approach 2:
A thermal transfer plate serves as an intermediary between the semiconductor wafer and the measurement chamber. The plate acts as a thermal buffer that equalizes temperature differences, allowing the wafer to reach thermal equilibrium with the measurement environment without direct thermal contact with the measurement chamber. This intermediary component simplifies the overall temperature control system while maintaining high measurement precision.
2Measurement precision
If temperature equalization is performed using a thermal transfer plate, then measurement precision is improved, but the thermal transfer plate's temperature stability deteriorates due to heat load from multiple wafers
Solution Approach 1:
Temperature sensors continuously monitor the thermal transfer plate's temperature, and a control system adjusts heating or cooling elements in real-time to maintain plate temperature stability. This feedback mechanism compensates for heat loads from multiple wafers, ensuring the plate remains at a stable temperature and can consistently equalize wafer temperatures without drifting.
Solution Approach 2:
The system changes the operational parameters of the thermal transfer plate by actively controlling its temperature through heating or cooling elements. Instead of relying on passive thermal equilibrium, the plate's temperature is dynamically adjusted to compensate for heat loads from wafers, maintaining stable operating conditions and consistent temperature equalization performance across multiple measurements.
3Measurement precision
If high accuracy mass measurement is performed, then measurement precision is improved, but the system becomes more sensitive to temperature variations
Solution Approach 1:
The system performs preliminary temperature equalization by placing the semiconductor wafer on a thermal transfer plate before measurement. The plate pre-cools or pre-heats the wafer to match the measurement chamber temperature, eliminating temperature differences before the actual mass measurement occurs. This preliminary action prevents temperature-related errors without requiring complex real-time temperature control during measurement.
Solution Approach 2:
A thermal transfer plate serves as an intermediary between the semiconductor wafer and the measurement chamber. The plate acts as a thermal buffer that equalizes temperature differences, allowing the wafer to reach thermal equilibrium with the measurement environment without direct thermal contact with the measurement chamber. This intermediary component simplifies the overall temperature control system while maintaining high measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of semiconductor wafer mass metrology by minimizing temperature-related errors, enabling more precise control of the semiconductor wafer's temperature and improving measurement outcomes.
Implementation Method 1
a first temperature changing part for changing a temperature of the semiconductor wafer before the semiconductor wafer is transported into the measurement chamber
Implementation Method 2
a first temperature sensor for sensing a first temperature, wherein the first temperature is: a temperature of the first temperature changing part; or a temperature of the semiconductor wafer when the semiconductor wafer is on the first temperature changing part, or when the semiconductor wafer leaves the first temperature changing part
Implementation Method 3
a measurement chamber for measuring the weight and/or the mass of a semiconductor wafer
Implementation Method 4
if the semiconductor wafers have a higher temperature than a measurement enclosure of the measurement apparatus, air currents (e.g. convection currents) may be generated in the air in the measurement enclosure
Implementation Method 5
the air in the measurement enclosure may be heated, changing its density and pressure and therefore the buoyancy force exerted on the semiconductor wafer by the air
Data Source
AI summary
A semiconductor wafer mass metrology apparatus comprising: a measurement chamber for measuring the weight and/or the mass of a semiconductor wafer; a first temperature changing part for changing a temperature of the semiconductor wafer before the semiconductor wafer is transported into the measurement chamber; and a first temperature sensor for sensing a first temperature, wherein the first temperature is: a temperature of the first temperature changing part; or a temperature of the semiconductor wafer when the semiconductor wafer is on the first temperature changing part, or when the semiconductor wafer leaves the first temperature changing part.