Wafer Material Mapping for Mixed-Substrate Process Temperature Control
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in safely accommodating wafers made of different materials, such as Si and SiC, as some materials cannot withstand the process temperatures, necessitating a protection function to prevent erroneous processing.
Innovation Solution
A mapping apparatus and controller system that determines the material of substrates, updating and holding first information on the material, and controlling the apparatus to prevent processing when conditions are not met, allowing safe and economic operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafers made of different materials are loaded together into the process furnace, then productivity is improved, but reliability deteriorates due to risk of processing incompatible materials at inappropriate temperatures
Solution Approach 1:
The system performs preliminary identification of wafer materials using a laser sensor before processing. The controller stores material information in advance and uses this pre-acquired data to determine compatibility with the current process temperature, preventing incompatible materials from being processed while allowing mixed-material loading for compatible wafers.
Solution Approach 2:
The system implements feedback by continuously monitoring wafer material identification results and comparing them against the current operation mode's temperature conditions. The controller adjusts processing decisions based on this feedback loop, allowing the system to dynamically determine whether to proceed with processing based on material-temperature compatibility.
2Reliability
If material identification and verification systems are added, then reliability is improved, but device complexity increases
Solution Approach 1:
The laser sensor serves multiple functions: it identifies wafer materials, determines wafer positions, and provides data for processing decisions. The controller integrates material identification, storage, and verification functions within its existing processing control architecture, avoiding the need for separate dedicated systems for each function.
Solution Approach 2:
The system uses an intermediary approach by storing material information in a database or memory structure that acts as a mediator between the laser sensor and the controller's decision-making process. This intermediary storage layer simplifies the interaction between detection and control functions.
Data Source
AI summary
It is possible to economically and safely operate an apparatus by allowing wafers made of different materials to be accommodated together. There is provided a technique that includes: a mapping apparatus configured to determine a material of a substrate accommodated in a carrier and loaded into the substrate processing apparatus; and a controller configured to be capable of updating and holding first information on the material of the substrate loaded into the substrate processing apparatus, and capable of controlling the substrate processing apparatus to take out the carrier accommodating the substrate when the first information on the material of the substrate does not satisfy a predetermined condition specified for a current operation mode among conditions specified respectively for a plurality of operation modes.