Wafer Measurement Recipe Sequencing for Flexible Batch Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional wafer measurement methods require inflexible environment parameters for a batch of wafers, leading to inefficient and time-consuming processes, with manual adjustments needed after each measurement.

Innovation Solution

A method and apparatus that generate multiple recipes for different parts of a wafer batch, allowing for automated control of measurement devices to adjust environment parameters and measure wafers efficiently and flexibly according to specific conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the same environment parameters are used for measuring all wafers in a batch, then the measurement process is simple to control, but the measurement flexibility and adaptability to different wafer properties deteriorate

Engineering Contradiction:
Improvemeasurement process controlVSAvoidadaptability to different wafer properties
Core Design Contradiction:
Ease of operationVSAdaptability or versatility

Solution Approach 1:

The patent divides a batch of wafers into multiple groups based on their properties, with each group assigned a specific environment parameter recipe. This segmentation allows different measurement conditions to be applied to different wafer groups simultaneously, resolving the contradiction between simple control and high adaptability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces multiple environment parameter recipes (first recipe, second recipe, etc.) with different parameter settings for different wafer groups. By changing parameters based on wafer properties rather than using fixed parameters for all wafers, the system achieves both ease of operation through automated recipe selection and adaptability through parameter variation.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If manual adjustment of environment parameters is performed after each measurement, then measurement accuracy can be optimized, but measurement efficiency and productivity deteriorate

Engineering Contradiction:
Improvemeasurement accuracyVSAvoidmeasurement efficiency
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent pre-configures multiple environment parameter recipes before measurement begins. The system automatically selects and applies the appropriate recipe based on wafer group identification, eliminating the need for manual parameter adjustment after each measurement. This preliminary preparation maintains measurement accuracy while dramatically improving productivity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The measurement system automatically identifies wafer groups and selects appropriate environment parameter recipes without operator intervention. The system serves itself by autonomously adjusting parameters based on pre-configured recipes, maintaining precision while eliminating manual adjustment time and improving overall measurement efficiency.

Inventive Principle:
Principle #25Self-service

3Adaptability or versatility

If multiple environment parameter recipes are generated and automatically applied to different wafer groups, then measurement flexibility and adaptability improve, but system complexity and device configuration complexity worsen

Engineering Contradiction:
Improvemeasurement flexibilityVSAvoidsystem configuration complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent creates a universal measurement system that can handle multiple wafer groups with different properties using a single integrated apparatus. The system uses a unified control method to manage multiple environment parameter recipes, making the complex system universally applicable to various wafer types without requiring separate measurement setups for each wafer group.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces an intermediary control system that manages the complexity of multiple environment parameter recipes. This intermediary layer automatically matches wafer groups with appropriate recipes based on pre-configured associations, shielding the user from the underlying complexity while maintaining high adaptability. The intermediary handles recipe selection and parameter application transparently.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20250323103A1Method and apparatus for wafer measurement
Publication Date: 2025.10.16 NAN YA TECH
  • US20250323103A1 patent drawing
  • US20250323103A1 patent drawing
  • US20250323103A1 patent drawing

AI summary

An apparatus and a method for wafer measurement are provided. The method includes the steps of: generating a measurement program associated with a plurality of recipes; and controlling at least one measurement device, by executing the measurement program, to automatically measure a plurality of wafers according to the plurality of recipes.