Wafer Measuring Fixture With Scale Marks For Broken Wafer Handling
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Solution Overview
Problem
Inappropriate management of broken wafers during the fabrication of integrated circuit devices often leads to secondary damages, resulting in erroneous defect determination and increased production costs due to the use of general-purpose plastic bags for storage.
Innovation Solution
A wafer-measuring fixture with a base and cover, featuring scale marks and magnets, designed to securely hold and protect broken wafers, preventing secondary damages and facilitating rapid defect analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a general-purpose plastic bag is used to hold a broken wafer, then the wafer can be stored, but the wafer may suffer secondary damages and defect analysis becomes difficult
Solution Approach 1:
The fixture segments the wafer holding function into distinct components: a base with carrying component for support, a cover for protection, and scale marks for measurement reference. This segmentation allows each component to perform its specific function optimally, preventing secondary damages while facilitating defect analysis.
Solution Approach 2:
The fixture acts as an intermediary between the broken wafer and the inspection process. By providing a structured environment with scale marks and protective enclosure, it mediates the transition from damaged state to analyzable state, enabling accurate defect determination without direct handling that could cause further damage.
2Adaptability or versatility
If individual operators manually manage broken wafers, then flexibility is maintained, but maintenance difficulties and secondary damages occur
Solution Approach 1:
The fixture provides universal functionality for handling broken wafers, combining protection, positioning, and measurement capabilities in a single device. This multi-functionality replaces multiple manual operations while maintaining adaptability to different wafer sizes through the appropriate carrying component selection.
Solution Approach 2:
The fixture enables self-service in wafer management by providing built-in scale marks for automatic measurement reference and a structured environment that prevents secondary damages without requiring constant operator intervention. The magnets and grooves work automatically to secure and protect the wafer.
3Quantity of substance
If broken wafers are placed in plastic bags, then storage is achieved, but measurement and defect location become time-consuming
Solution Approach 1:
The fixture performs preliminary measurement preparation by incorporating scale marks directly on the carrying component and cover. This preliminary action establishes a measurement reference framework before the wafer is placed, eliminating the need for time-consuming external measurement procedures during defect analysis.
Solution Approach 2:
The fixture utilizes visual contrast through scale marks and grooves that create distinct visual references. The acrylic material and magnetic components provide visual cues that accelerate defect location and measurement, reducing analysis time compared to opaque plastic bags.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wafer-measuring fixture minimizes secondary damages, enables quick identification of defect causes, and enhances production yield and cost efficiency by providing a secure and structured method for handling broken wafers.
Implementation Method 1
at least two magnets which are respectively fixed on the base and the cover and disposed at corresponding locations
Data Source
AI summary
A wafer-measuring fixture suitable for carrying a broken wafer is described. The wafer-measuring fixture comprises a base having a carrying component. The carrying component is used to hold the broken wafer. Furthermore, a plurality of scale marks is set around the carrying component to mark the broken positions on the wafer.