Wafer-on-Wafer Memory-Logic Bus for High-Bandwidth 3D Integration

The patent applies preliminary action by performing alignment marks formation and wafer bonding operations before dicing the wafers into individual devices. This allows the bonding interface to be established at the wafer level with proper alignment, and then the bonded wafers are cut into individual memory and logic devices. This approach resolves the contradiction by enabling high-bandwidth bonded connections to be created efficiently at the wafer level rather than requiring expensive and time-consuming individual device alignment and bonding operations.

The patent applies merging by integrating memory devices and logic devices into a single bonded 3D integrated circuit package. The memory wafer and logic wafer are bonded together to form a unified system where data can be transferred directly between memory and logic through the bonded interface. This resolves the contradiction by combining separate devices into an integrated system that reduces power consumption through direct high-bandwidth communication, while the overall device complexity remains manageable due to the modular wafer-level integration approach.