Wafer Mesh Converter Fill for Optically Isolated LED Pixels

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Solution Overview

Problem

The manufacturing of small addressable LED pixel systems requires precise deposition of materials due to their small size and tight spacing, which is challenging with current techniques, especially for high-brightness light emitting devices like III-nitride semiconductors used in precision control lighting applications.

Innovation Solution

An optical isolation material is applied to the walls of cavities in a wafer mesh, and a wavelength converting layer is deposited into these cavities to create segments that are then attached to light emitting devices, allowing for the creation of precise LED pixels with optical isolation between them.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional material deposition techniques are used for small LED pixels, then manufacturing process is simpler, but manufacturing precision deteriorates due to tight spacing between pixels

Engineering Contradiction:

Improvematerial deposition precisionVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides the LED pixel structure into multiple segments separated by cavities and optical isolation material. Each pixel is segmented into distinct regions (first segment, second segment, third segment) that can be independently filled with different materials. This segmentation enables precise material deposition in each region while preventing cross-contamination, directly resolving the contradiction between manufacturing precision and process complexity by making the deposition process more controllable despite increased structural complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different materials to different local regions of the LED pixel structure. Optical isolation material is applied specifically to cavity walls, while wavelength converting layers are deposited into specific cavities. This local quality approach allows precise control over material placement in tight spaces, achieving high manufacturing precision without requiring complete redesign of the entire manufacturing process

Inventive Principle:

Principle #3Local quality

2Reliability

If optical isolation material is applied to cavity walls, then optical isolation between pixels is improved, but device complexity increases

Engineering Contradiction:

Improveoptical isolation accuracyVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces optical isolation material as an intermediary substance applied to the cavity walls between pixel segments. This intermediary layer prevents optical cross-talk between adjacent pixels while maintaining the structural integrity of the compact LED array. The optical isolation material acts as a mediator that enables reliable optical isolation without requiring complex mechanical separation structures, thus improving reliability while managing device complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

3Adaptability or versatility

If wavelength converting layer is deposited into cavities, then LED pixel functionality is improved, but manufacturing precision requirements increase

Engineering Contradiction:

ImproveLED pixel functionalityVSAvoidmaterial deposition precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies optical isolation material to cavity walls before depositing wavelength converting layers into the cavities. This preliminary action creates a prepared environment that prevents material cross-contamination and ensures clean interfaces between different functional layers. By performing the isolation step first, the subsequent wavelength converting layer deposition becomes more tolerant to variations, reducing the overall manufacturing precision requirements while maintaining enhanced LED pixel functionality

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the production of sub-500 micron pixels with sub-100 micron components, providing accurate optical isolation and precise control over LED arrays, enhancing the efficiency and precision of LED pixel systems.

Implementation Method 1

An optical isolation material may be applied to walls of a first cavity and a second cavity in a wafer mesh

Methodology Applied

Scientific EffectOptical isolation: Absorption (EM radiation)

Implementation Method 2

A wavelength converting layer may be deposited into the first cavity to create a first segment and into the second cavity to create a second segment

Methodology Applied

Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS11973169B2Converter fill for LED array

Publication Date: 2024.04.30 LUMILEDS SINGAPORE PTE LTD

AI summary

An optical isolation material may be applied to walls of a first cavity and a second cavity in a wafer mesh. A wavelength converting layer may be deposited into the first cavity to create a first segment and into the second cavity to create a second segment. The first segment may be attached to a first light emitting device to create a first pixel and the second segment to a second light emitting device to create a second pixel. The wafer mesh may be removed.