Wafer Microchips with Faraday Cages and Siped Compartments
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Solution Overview
Problem
The challenges of wafer-scale integration include inherent flaws in semiconductor wafers and thermal expansion issues between microelectronic components and circuit boards, leading to connector damage and failed attempts at developing supercomputers using this technology.
Innovation Solution
The integration of Faraday Cages and siped compartments, allowing for independent operation of wafer microchips with wireless or optical connections, reducing the need for pins and handling of flawed microchips, and using stacked wafers with similar expansion rates to mitigate thermal expansion problems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor wafers are used with inherent flaws, then manufacturing cost is reduced, but system reliability deteriorates
Solution Approach 1:
The wafer is divided into multiple independent microchip compartments, each capable of independent operation. This segmentation allows flawed microchips to be isolated and ignored while others continue to function, resolving the contradiction between using imperfect wafers and maintaining system reliability
Solution Approach 2:
The invention changes the operational parameter from requiring all microchips to function to allowing independent operation of individual microchips. This parameter change enables the system to tolerate flaws in some microchips while maintaining overall functionality and reliability
2Reliability
If conventional pin connections are used between microelectronic components and circuit boards, then electrical connectivity is achieved, but thermal expansion damage occurs
Solution Approach 1:
The invention replaces the mechanical pin connection system with wireless or optical communication systems. This substitution eliminates the mechanical stress and thermal expansion damage associated with physical connectors while maintaining electrical connectivity functionality
Solution Approach 2:
The invention introduces wireless signals or optical beams as intermediaries to transfer information and power between microelectronic components and circuit boards, replacing direct mechanical contact and eliminating thermal expansion-related connector damage
3Reliability
If elaborate handling procedures are implemented for flawed microchips, then defect management is improved, but device complexity increases
Solution Approach 1:
By segmenting the wafer into independent microchip compartments, the invention simplifies defect management. Each microchip can be independently evaluated and activated or deactivated based on its functionality, eliminating the need for elaborate handling procedures while maintaining reliable defect management
Solution Approach 2:
The system automatically identifies and isolates flawed microchips through independent operation capability, eliminating the need for complex external handling procedures. Each microchip essentially manages its own operational status, reducing overall system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables wafer-scale integration by allowing flawed microchips to be ignored, reducing the need for elaborate handling and minimizing thermal expansion issues, thus facilitating the creation of reliable and efficient semiconductor systems.
Implementation Method 1
Devices with faraday cages and internal flexibility sipes
Data Source
AI summary
A computer or microchip comprising an outer chamber and at least one inner chamber inside the outer chamber. The outer chamber and the inner chamber being separated at least in part by an internal sipe, and at least a portion of a surface of the outer chamber forming at least a portion of a surface of the internal sipe. The internal sipe has opposing surfaces that are separate from each other and therefore can move relative to each other, and at least a portion of the opposing surfaces are in contact with each other in a unloaded condition. The outer chamber including a Faraday Cage. A computer, comprising a semiconductor wafer having a multitude of microchips. The multitude of microchips forming a plurality of independently functioning computers, each computer having independent communication capabilities.