Wafer Module Attachment Device Using Segmented Legs
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Solution Overview
Problem
Conventional methods for attaching heat shield modules to wafer substrates in high temperature environments are prone to micro-crack formation, substrate weakening, and thermal conductivity issues, which compromise the reliability and accuracy of process condition measurements in semiconductor fabrication.
Innovation Solution
The use of an attachment device comprising a module leg and foot, where the leg is made of low thermal conductivity materials like stainless steel or quartz, and the foot is designed with a large surface area to minimize heat transfer and mechanical stress, allowing secure attachment without grinding the wafer and maintaining operational integrity at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rivet pins are inserted into T-slots and adhesive is used to attach the module, then the module can be mounted to the substrate, but the wafer must be ground which causes micro-cracks and weakens the wafer
Solution Approach 1:
The attachment device is divided into separate components: a module leg that attaches to the module and a module foot that attaches to the substrate. This segmentation allows the attachment mechanism to be separated from the substrate, eliminating the need to grind the wafer and preventing micro-crack formation while still providing reliable module mounting.
Solution Approach 2:
The module leg and foot act as intermediary components between the module and the substrate. Instead of directly attaching the module to the substrate (which requires grinding), the intermediary attachment device provides a mechanical connection that avoids substrate modification and prevents structural weakening.
2Reliability
If the module is attached directly to the substrate, then secure mounting is achieved, but thermal stress and heat transfer to temperature-sensitive components increases
Solution Approach 1:
By separating the attachment device into a module leg and foot with a gap between them, the design segments the thermal path. This segmentation creates thermal isolation that reduces heat transfer to temperature-sensitive components while maintaining secure mechanical mounting through the distributed contact points of the leg and foot.
Solution Approach 2:
The module leg and foot serve as thermal intermediaries that manage heat transfer. The attachment device structure acts as a thermal barrier and stress distributor, mediating between the hot substrate and the temperature-sensitive module components to reduce thermal stress and heat exposure.
3Reliability
If high-strength attachment methods are used to secure the module, then mounting reliability improves, but the risk of mechanical failure and substrate damage increases
Solution Approach 1:
The attachment device is segmented into multiple contact points through the module leg and foot structure. This segmentation distributes mechanical stress across multiple locations on the substrate rather than concentrating force at a single point, reducing the risk of substrate damage while maintaining secure module mounting through cumulative attachment strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable attachment of heat shield modules to wafer substrates in high temperature environments, preventing thermal conductivity issues and mechanical stress, thus ensuring accurate process condition measurements and maintaining device performance.
Implementation Method 1
the leg is made of low thermal conductivity and high-strength materials like stainless steel or quartz
Implementation Method 2
accommodating thermal expansion differences
Data Source
AI summary
Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.