Wafer Mount Adhesive Layer Segmentation for Thermal Uniformity
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Solution Overview
Problem
Existing wafer mount devices face challenges in achieving high attraction/detachment performance due to insufficient bonding force between the electrostatic chuck and the cooling plate, particularly with the use of hardened matter of fluid adhesives, which can lead to contamination and reduced thermal uniformity.
Innovation Solution
A wafer mount device design that incorporates a dual adhesive layer system, where a hardened matter of fluid adhesive is used on the back surface and double-faced tape is applied to the outer peripheral edges, enhancing the attraction/detachment performance by minimizing outgas contamination and improving thermal uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If only a hardened matter of fluid adhesive is used to bond the electrostatic chuck and cooling plate, then bonding force is sufficient, but attraction/detachment performance is reduced due to outgas contamination
Solution Approach 1:
The adhesive layer is segmented into two distinct portions: a first adhesive portion made of hardened matter of fluid adhesive for sufficient bonding force, and a second adhesive portion made of double-faced tape for preventing outgas contamination. This segmentation allows each portion to fulfill its specific function without compromising the other.
Solution Approach 2:
Different regions of the adhesive layer are assigned different materials and functions. The first adhesive portion (hardened matter) provides bonding strength where needed, while the second adhesive portion (double-faced tape) provides contamination prevention at the outer peripheral edge. This local differentiation optimizes both bonding force and attraction/detachment performance.
2Reliability
If only a double-faced tape is used to bond the electrostatic chuck and cooling plate, then attraction/detachment performance is improved, but bonding force is insufficient
Solution Approach 1:
The adhesive system is divided into two functional portions: the first adhesive portion made of hardened matter of fluid adhesive provides sufficient bonding force, while the second adhesive portion made of double-faced tape prevents outgas contamination. Together they achieve both strong bonding and high attraction/detachment performance.
Solution Approach 2:
The adhesive layer uses a composite structure combining two different adhesive materials: hardened matter of fluid adhesive and double-faced tape. This composite approach leverages the strengths of both materials to achieve superior overall performance compared to using either material alone.
3Strength
If the adhesive layer thickness is increased to improve bonding, then bonding force is enhanced, but thermal uniformity is degraded
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness distribution: thinner at the outer peripheral edge where the double-faced tape is applied, and thicker only in the central first adhesive portion. This local thickness differentiation maintains bonding force while minimizing thermal resistance and improving thermal uniformity across the electrostatic chuck surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual adhesive layer system significantly increases the attraction/detachment performance and thermal uniformity of the wafer mount device, as demonstrated by improved results in attraction force, detachment time, and temperature distribution stability.
Implementation Method 1
a disk-like ceramic plate being capable of attracting a wafer to a front surface of the plate
Implementation Method 2
a second adhesive portion made of a double-faced tape, wherein the second adhesive portion bonds an outer peripheral edge on the back surface of the plate and an outer peripheral edge on the front surface of the cooling plate together
Data Source
AI summary
An adhesive layer that bonds the back surface of a plate capable of attracting a wafer and the front surface of a cooling plate together that includes a main adhesive portion, which is made of a hardened matter of a fluid adhesive, and an outer peripheral adhesive portion, gas-supply-hole adhesive portions, lift-pin-hole adhesive portions, and terminal-hole adhesive portions made of a double-faced tape. The tape portions bond the outer peripheral edge on the back surface of the plate and the outer peripheral edge on the front surface of the cooling plate together, and the outer peripheral edges of the holes on the back surface of the plate and the outer peripheral edges of these holes on the front surface of the cooling plate together.