Wafer Mounting Position Correction Using Ring Mask Deviation
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Solution Overview
Problem
Existing film forming systems struggle to accurately form non-film formation regions at the edge portions of semiconductor wafers, leading to misalignment and contamination issues when forming multilayer films, as existing techniques fail to correct positional deviations of these regions.
Innovation Solution
A method involving a ring-shaped mask with a circular opening is used to form a non-film formation region at the edge of a wafer, where a test substrate is intentionally deviated from the intended position to measure and correct the actual arrangement position of the mask, ensuring accurate positioning for both film and non-film formation regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the non-film formation region is formed at the edge portion of the wafer using a ring-shaped mask, then the end effector can be protected from contamination, but the positional deviation of the non-film formation region cannot be corrected when formed at an incorrect position
Solution Approach 1:
The patent performs preliminary positioning correction by measuring the actual position of the ring-shaped mask relative to the wafer center before film formation. The mounting position of the wafer is adjusted based on the measured mask position to ensure the non-film formation region is formed at the correct edge position, preventing subsequent contamination issues.
Solution Approach 2:
The patent implements a feedback mechanism where the actual position of the ring-shaped mask is measured using a measurement device, and this measurement information is used to correct the mounting position of the wafer. This closed-loop control ensures that the non-film formation region is formed at the precise intended location.
2Productivity
If the mounting position of the wafer is not corrected, then the film formation process can proceed without additional positioning steps, but misaligned films are laminated when forming multilayer films
Solution Approach 1:
The patent performs preliminary positioning correction by measuring the actual position of the ring-shaped mask and adjusting the wafer mounting position before film formation. This preliminary correction ensures that subsequent film formation operations, including multilayer film stacking, proceed with proper alignment without requiring repositioning between layers.
Solution Approach 2:
The patent uses measurement feedback of the mask position to correct the wafer mounting position, creating a closed-loop system that ensures accurate positioning for multilayer film formation. This feedback mechanism maintains alignment accuracy across multiple film formation steps.
Data Source
AI summary
In a method for setting a mounting position of a target substrate, the test substrate is transferred to a second position deviated from a first position. A mask has expected arrangement position where a non-film formation region has a preset width when the target substrate is mounted at the first position and subjected to a film formation. The film is formed on the test substrate at the second position by using the mask. Width of the non-film formation region formed on the test substrate after the film formation is measured. Actual arrangement position of the mask is specified based on a direction and a distance of the deviation of the second position from the first position and the measured width of the non-film formation region. The first position is corrected such that the non-film formation region has the preset width based on the actual arrangement position of the mask.