Wafer Mounting Table Ceramic-Mesh Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing method of manufacturing wafer mounting tables using a ceramic plate with a metal mesh electrode faces issues of positional displacement and interfacial separation between the metal mesh and the sintered body during press forming and hot press firing.
Innovation Solution
A method involving loading a ceramic slurry with a gelling agent into a metal mesh, followed by degreasing and calcining to create a ceramic-loaded mesh, which is then sandwiched between two ceramic calcined bodies and hot press fired to prevent positional displacement and interfacial separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If granules are loaded onto metal mesh and press forming is performed, then a multilayer body can be prepared, but granules migrate from high loading density region to low loading density region causing positional displacement of the metal mesh
Solution Approach 1:
The metal mesh is embedded into the ceramic green body before pressing, so that the mesh is fixed in position before the pressing operation occurs. This preliminary positioning prevents the mesh from displacing during the subsequent pressing process, resolving the contradiction between ease of manufacture and manufacturing precision.
2Manufacturing precision
If metal mesh is sandwiched between two ceramic calcined bodies, then positional displacement can be prevented, but separation occurs at the interface between the metal mesh and the sintered body
Solution Approach 1:
The metal mesh and ceramic powder are combined into a single integrated green body structure before sintering. The mesh is embedded within the ceramic matrix rather than being placed as a separate layer between calcined bodies. This merging ensures that both the metal mesh and ceramic sinter together as one unified structure, preventing interface separation while maintaining positional accuracy.
3Manufacturing precision
If ceramic slurry is loaded into opening portions of metal mesh, then ceramic can be fixed to the mesh, but air bubbles may be incorporated into the slurry
Solution Approach 1:
The slurry loading process is performed in a vacuum environment, which removes air bubbles from the slurry before it is applied to the metal mesh. The vacuum conditions ensure that the ceramic slurry is free of trapped air, preventing defects in the final green body while maintaining uniform ceramic loading on the mesh.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively prevents positional displacement of the metal mesh and interfacial separation, ensuring a stable and integrated metal mesh within the ceramic plate, maintaining structural integrity during the manufacturing process.
Implementation Method 1
inducing a chemical reaction of the gelling agent to gelate the ceramic slurry
Implementation Method 2
hot press firing the multilayer body to prepare a wafer mounting table
Data Source
AI summary
A method of manufacturing a wafer mounting table according to an embodiment includes: (a) a step of loading a ceramic slurry containing a ceramic powder and a gelling agent into opening portions of a metal mesh, inducing a chemical reaction of the gelling agent to gelate the ceramic slurry, and then performing degreasing and calcining to prepare a ceramic-loaded mesh; (b) a step of sandwiching the ceramic-loaded mesh between a first ceramic calcined body and a second ceramic calcined body obtained by calcining after mold cast forming so as to prepare a multilayer body; and (c) a step of hot press firing the multilayer body to prepare the wafer-receiving table.