Wafer Mounting Table Stacked Metal Mesh Conductive Section
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Solution Overview
Problem
Conventional wafer mounting tables experience poor thermal uniformity due to increased impedance and high temperature in the conductive section caused by a zigzag metal mesh design, leading to uneven heat generation during plasma treatment.
Innovation Solution
A wafer mounting table with a conductive section comprising stacked plate-shaped metal mesh members parallel to the wafer mounting surface, reducing impedance and maintaining thermal uniformity by ensuring the conductive path length equals the distance between electrodes, and incorporating ceramic material in the mesh space for added strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal mesh is bent in zigzag to connect the first electrode and the second electrode, then the conductive section can be formed, but the conductive path length becomes significantly longer than the distance between electrodes, increasing impedance and causing abnormal heat generation
Solution Approach 1:
The patent transitions from a three-dimensional zigzag bent mesh to a two-dimensional stacked plate configuration. Multiple plate-shaped metal mesh members are stacked parallel to each other between the electrodes, creating a conductive path that is substantially equal to the electrode distance while maintaining manufacturing flexibility. This dimensional change eliminates the unnecessary path length extension caused by zigzag bending.
Solution Approach 2:
The conductive section is divided into multiple separate plate-shaped metal mesh members that are stacked between the electrodes. Each plate is flat and parallel to the electrode surfaces, with the stack collectively forming the conductive connection. This segmentation allows each component to be simple and flat, avoiding the complex zigzag geometry while achieving the desired electrical connection.
2Ease of manufacture
If a zigzag metal mesh is used as the conductive section, then the electrodes can be connected, but the impedance increases due to the extended conductive path length
Solution Approach 1:
By stacking flat plate-shaped meshes in layers between the electrodes rather than bending a single mesh in zigzag, the conductive path length is minimized to be substantially equal to the electrode separation distance. This dimensional reconfiguration reduces the conductive path length while maintaining the structural flexibility needed for manufacturing.
3Adaptability or versatility
If the first electrode is a disc electrode and the second electrode is a ring-shaped electrode with non-overlapping portions, then the electrode configuration is achieved, but different effects are given to different portions of the wafer
Solution Approach 1:
The patent applies different electrode configurations to different regions of the wafer processing area. The first disc electrode and second ring-shaped electrode create overlapping and non-overlapping regions, allowing different plasma effects and thermal characteristics in different zones. This local differentiation enables optimized processing for different wafer regions while maintaining overall system functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces high-frequency impedance, prevents abnormally high temperatures, and enhances thermal uniformity of the wafer, while allowing for precise control of electrode distances and preventing ceramic substrate cracking during calcination.
Implementation Method 1
a conductive section that electrically connects the first electrode and the second electrode
Implementation Method 2
the impedance when a high frequency current flows is decreased
Implementation Method 3
the amount of heat generation in the conductive section is increased... an upper portion of the conductive section has an abnormally high temperature... the thermal uniformity of the wafer becomes favorable
Data Source
AI summary
A wafer mounting table includes a first electrode and a second electrode buried inside of a ceramic substrate having a wafer mounting surface so as to be parallel to the wafer mounting surface with the first electrode closer to the wafer mounting surface than the second electrode. The wafer mounting table includes a conductive section that electrically conducts the first electrode and the second electrode. The conductive section is such that a plurality of circular members comprised of plate-shaped metal meshes parallel to the wafer mounting surface are stacked between the first electrode and the second electrode.