Wafer Notch Locating Component for Precision Alignment

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Solution Overview

Problem

The challenge in semiconductor wafer-to-wafer bonding is accurately aligning and centering wafers to prevent fracture, surface damage, and warping, while ensuring uniform bond strength across the interface, which is critical for manufacturing yield and cost-effectiveness in electronic products.

Innovation Solution

A device with a notch locating component and a flat feature locating component, featuring a linearly moving elongated component with protrusions that complement the wafer's notch or flat feature, assisted by position sensors and rollers, ensures precise engagement and alignment, along with a support chuck and rotating alignment arms for centering, to maintain wafer integrity during transport and bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If manual or simple mechanical alignment methods are used for wafer alignment, then device complexity is reduced, but manufacturing precision and alignment accuracy deteriorate

Engineering Contradiction:
Improvewafer alignment accuracyVSAvoidalignment device complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The wafer's own geometric features (notch or flat) are utilized as the alignment reference, eliminating the need for external alignment marks or complex optical systems. The protrusion on the alignment arm mechanically engages with the wafer's notch/flat, allowing the wafer to define its own alignment position through its inherent geometry.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent replaces complex optical alignment systems with a purely mechanical engagement system. The protrusion-notch mechanical interface provides precise alignment through direct physical contact, substituting for sophisticated optical sensors and alignment algorithms while reducing device complexity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If precise alignment and centering mechanisms are implemented, then manufacturing precision improves, but device complexity increases

Engineering Contradiction:
Improvewafer centering precisionVSAvoidcentering device complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment system is divided into independent functional segments: the alignment arm with protrusion for radial alignment, the rotational mechanism for angular positioning, and the vertical actuation for engagement. Each segment performs a specific alignment function independently, simplifying the overall system while achieving precise centering.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The alignment arm is pre-positioned with the protrusion oriented toward the expected location of the wafer's notch or flat feature. This preliminary positioning allows the mechanical engagement to occur automatically during wafer loading, achieving precise alignment without requiring complex real-time adjustment mechanisms.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If wafer handling is performed without specialized alignment features, then ease of operation improves, but manufacturing precision deteriorates

Engineering Contradiction:
Improvebond interface alignmentVSAvoidwafer handling simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The alignment system utilizes the asymmetric geometric feature (notch or flat) inherently present on the otherwise circular wafer. This asymmetric feature provides a unique mechanical interface for the protrusion, enabling precise angular and radial alignment during handling without complicating the overall wafer design or handling procedure.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS9859141B2Apparatus and method for aligning and centering wafers
Publication Date: 2018.01.02 SUSS MICROTEC LITHOGRAPHY GMBH
  • US9859141B2 patent drawing
  • US9859141B2 patent drawing
  • US9859141B2 patent drawing

AI summary

A device for locating and engaging a notch on the perimeter of a circular wafer includes a notch locating component and a first plate. The notch locating component is configured to move linearly along a first axis and includes a front elongated component extending along a second axis perpendicular to the first axis and having a front surface, a back surface opposite to the front surface and a first protrusion extending from the front surface of the elongated component. The first protrusion has a shape complementing the shape of a notch formed on the perimeter of a circular wafer. As the notch locating component is driven toward the perimeter of the circular wafer along the first axis, a distance between the back surface of the elongated component and a front surface of the first plate is measured and the value of the measured distance is used to determine engagement of the first protrusion with the notch.