Wafer Notch Leveling via Mechanical Intermediary and Laser Detection
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Solution Overview
Problem
Conventional wafer notch leveling methods, such as laser-based systems and manual edge-finding devices, are prone to errors and do not meet the automation needs of modern manufacturing lines, leading to inaccurate positioning and increased operational complexity.
Innovation Solution
A wafer notch leveling device comprising a body with a support portion, a first rotating portion with a driving wheel and auxiliary wheel, a positioning portion with a detaching fulcrum, and a control unit connected to power members for precise automation, utilizing low friction materials and a laser positioning device for accurate notch detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If laser-based positioning is used, then automation is improved, but positioning precision deteriorates due to beam blocking and rotation errors
Solution Approach 1:
The patent introduces a positioning part with a positioning tip as an intermediary mechanical element that physically contacts the wafer notch. This mechanical intermediary translates the wafer's notch position into direct mechanical feedback, allowing the system to detect notch alignment through physical contact rather than relying solely on laser beam passage, thereby improving positioning precision while maintaining automation
Solution Approach 2:
The patent replaces the purely optical laser positioning system with a hybrid system that incorporates mechanical elements (positioning part, supporting arms, pivot portions). The mechanical system provides direct physical interaction with the wafer notch, substituting the unreliable laser beam blocking method with tactile feedback through the positioning tip, thus resolving the precision issue while preserving automation
2Measurement precision
If manual edge-finding devices are used, then positioning precision is improved, but productivity deteriorates due to manual operation
Solution Approach 1:
The positioning part is designed to automatically detect and locate the wafer notch through self-service mechanical action. The positioning tip autonomously contacts the notch and triggers the detaching fulcrum mechanism, eliminating the need for manual operator intervention while maintaining the precision of mechanical edge-finding, thus resolving the contradiction between precision and productivity
Solution Approach 2:
The patent employs dynamic supporting arms that can rotate and adjust their position automatically. The supporting arms pivot around pivot portions and can dynamically respond to the wafer's position, allowing the system to adapt to different wafers automatically without manual repositioning, thereby maintaining precision while enabling automated high-speed operation
3Reliability
If multiple devices are combined for positioning, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the laser positioning device and the mechanical positioning system into a single integrated device. The laser emitter and receiver are combined with the supporting arms, positioning part, and detaching fulcrum in one unified structure, allowing both optical and mechanical positioning methods to work together simultaneously. This integration improves reliability through multiple positioning mechanisms while avoiding the complexity of separate independent devices by combining them into a coordinated system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enables precise and reliable automation of wafer notch leveling, reducing errors and enhancing production efficiency by combining physical and laser-based positioning for accurate notch alignment and positioning within automated manufacturing lines.
Implementation Method 1
the laser beam emitted by the laser emitter can pass through the notch and reach the laser receiver
Implementation Method 2
If the laser beam emitted by the laser emitter is blocked by the wafer, the wafer starts to rotate. When it rotates to the notch on the edge of the wafer, the beam emitted by the laser emitter can pass through the notch
Implementation Method 3
The driving wheel and the auxiliary wheel are high friction coefficient materials which is selected from the group consisting of polyetheretherketone (PEEK), polyphenylene sulfide (PPS), polyamidoamine (PA), acetal polyoxymethylene (POM) and polyimide ethylene terephthalate (PET)
Implementation Method 4
the partitioning comb plate is a low friction coefficient material which is selected from the group consisting of polytetrafluoroethylene (PTFE), monofluoroethylene propylene copolymer (FEP), monoethylene and tetrafluoroethylene copolymer (ETFE)
Data Source
AI summary
The present invention provides a wafer notch leveling device, which comprises a body, a first rotating portion, a positioning portion, a power portion, and a control unit. The body has a support portion and a pivot portion is provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms. The first rotating portion and the positioning portion are electrically connected with the power portion. The power portion is electrically connected with the control unit. Especially, when a plurality of wafers are placed on the support portion and fixed, the first rotating portion is electrically connected with the power portion through the control unit to drive the plurality of wafers to rotate the wafers, a notch on the wafer is leveled through the positioning portion.