Wafer Notch Alignment Using Optical Detection and Speed Sensing
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Solution Overview
Problem
Existing wafer alignment and speed calculation methods are inadequate for accurately positioning the notch of 6-inch wafers, leading to potential wafer dropping and compromising the safety and reliability of the process.
Innovation Solution
A wafer alignment device and method that uses a signal transmitting mechanism and a signal receiving mechanism to determine the position of the notch on the wafer by transmitting a signal through the notch and measuring its intensity, allowing for precise alignment and speed calculation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional clamping mechanisms are used for 6-inch wafers with large notches, then the clamping structure is simple, but the wafers may fall and the reliability is compromised
Solution Approach 1:
The alignment device performs preliminary positioning of the wafer notch before the clamping operation. By detecting the notch position in advance and adjusting the wafer orientation, the system ensures that subsequent clamping operations can proceed with standard mechanisms without requiring complex adaptive clamping structures.
Solution Approach 2:
The alignment device acts as an intermediary between the wafer and the clamping mechanism. It detects and corrects the notch position, serving as a mediator that enables the simple clamping mechanism to handle wafers reliably without direct complexity in the clamping structure itself.
2Measurement precision
If the notch position is not accurately located after cleaning, then the positioning requirement for the clamping mechanism increases, but this increases the complexity and reduces the reliability of the clamping mechanism
Solution Approach 1:
The alignment device performs preliminary positioning of the wafer notch before the clamping operation. By detecting the notch position in advance and adjusting the wafer orientation, the system ensures that subsequent clamping operations can proceed with standard mechanisms without requiring complex adaptive clamping structures.
Solution Approach 2:
The system replaces complex mechanical positioning requirements in the clamping mechanism with an optical detection and control system. The alignment device uses signal transmission and reception to detect notch position, substituting mechanical complexity with optical measurement and control logic.
3Manufacturing precision
If existing wafer alignment methods are used, then the device structure may be simple, but the accuracy of wafer positioning and speed calculation is insufficient
Solution Approach 1:
The system replaces complex mechanical positioning requirements in the clamping mechanism with an optical detection and control system. The alignment device uses signal transmission and reception to detect notch position, substituting mechanical complexity with optical measurement and control logic.
Solution Approach 2:
The alignment device employs a feedback mechanism where the signal receiving mechanism detects the notch position, the control mechanism processes this information, and adjusts the wafer orientation accordingly. This closed-loop feedback system achieves high positioning accuracy without requiring overly complex mechanical structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the accuracy of wafer positioning, enhances the reliability of wafer gripping and transferring, and allows for precise recording of wafer rotation speed, thereby increasing process control accuracy and safety.
Implementation Method 1
a signal transmitting mechanism used for transmitting a signal towards the wafer, wherein the signal is allowed to pass through the notch and will be blocked by the wafer other than the notch
Implementation Method 2
the signal transmitting mechanism is a laser generator, the signal receiving mechanism is a laser receiver, and the signal is a laser band
Implementation Method 3
the signal transmitting mechanism and the signal receiving mechanism are configured as a retro-reflective laser generator
Data Source
AI summary
Disclosed is a wafer alignment device. The wafer is in a rotating state, and the outer edge of the wafer is provided with a notch part. The wafer alignment device at least comprises: a signal transmitting mechanism used for transmitting a signal to a direction where the wafer is located, the signal being able to pass through the notch part, and the signal being blocked by the wafer when passing through the wafer; and a signal receiving mechanism used for receiving the signal transmitted by the signal transmitting mechanism so as to determine whether the notch part passes through the signal transmitting path or determine the number of times that the notch part passes through the signal transmitting path. Further disclosed is a wafer alignment method. Further disclosed is a wafer speed calculation method.