Wafer-Level Optical Module Assembly for Compact High-Precision Alignment
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Solution Overview
Problem
Existing methods of forming optical modules result in bulky modules due to individual alignment and assembly of optical elements, leading to complicated processes and increased costs.
Innovation Solution
Fabricate optical elements on separate wafers and perform wafer-level alignments and bonding to form optical modules, followed by singulation, using semiconductor-comparable processes to reduce dimensions and improve productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple individual optical elements are aligned and assembled separately, then each optical element can be precisely positioned, but the optical module becomes bulky and the assembly process becomes complicated
Solution Approach 1:
The patent merges multiple separate optical elements (lens, beam splitter, filter, VCSEL, image sensor) onto a single substrate, integrating them into one compact optical module. This consolidation eliminates the need for separate alignment and assembly of individual elements, thereby reducing module size and simplifying the assembly process while maintaining positioning precision through integrated fabrication
2Manufacturing precision
If multiple individual optical elements are aligned and assembled separately, then each optical element can be precisely positioned, but the production cost increases
Solution Approach 1:
The patent combines multiple optical elements into a single integrated module fabricated on one substrate, enabling batch production techniques to be applied. This approach reduces per-unit costs by eliminating repeated alignment and assembly operations for each individual element, while maintaining manufacturing precision through integrated fabrication processes
3Productivity
If wafer-level alignment and bonding is used to form optical modules, then module dimensions are reduced and productivity increases, but the alignment process becomes more complex
Solution Approach 1:
The patent transitions from individual element assembly in three-dimensional space to wafer-level processing in a planar two-dimensional dimension. By fabricating and aligning multiple optical elements on wafer-scale substrates before final module formation, the process enables parallel production of multiple modules simultaneously, dramatically increasing productivity while the planar alignment approach simplifies the overall complexity compared to sequential 3D assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves reduced module dimensions, increased productivity, and decreased costs by eliminating repeated alignment processes at the individual module level.
Implementation Method 1
aligning the first wafer with the second wafer, wherein, upon the aligning of the first wafer with the second wafer, each of the plurality of first optical elements is vertically overlapped with a corresponding second optical element of the plurality of second optical elements
Implementation Method 2
bonding the first wafer with the second wafer, thereby obtaining a first bonded structure
Data Source
AI summary
Optical modules and methods of forming the same are provided. In an embodiment, an exemplary method includes forming multiple first optical elements over a first wafer, forming multiple second optical elements over a second wafer, forming multiple third optical elements over a third wafer, aligning the first wafer with the second wafer such that, upon the aligning of the first wafer with the second wafer, each first optical element is vertically overlapped with a corresponding second optical element. The method also includes bonding the first wafer with the second wafer to form a first bonded structure, aligning the second wafer with the third wafer such that, and upon bonding the second wafer of the first bonded structure to the third wafer, where upon the aligning of the second wafer with the third wafer, each second optical element is vertically overlapped with a corresponding third optical element.