Wafer-Level Optical Module Layout With Non-Overlapping Microstructures
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Solution Overview
Problem
The miniaturization and cost reduction of wafer level optical modules are hindered by increasing structural complexity due to the growing number of optical components, making it difficult to achieve high integration and functionality.
Innovation Solution
A wafer level optical module design featuring two substrates with non-overlapping optical microstructures on each surface, separated by a spacer, which allows for enhanced optical functionality and integration by positioning the optical films in a gap defined by the substrates and spacer, along with optional index matching and buffer layers for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of optical components is increased to enhance optical functionality, then the optical functionality is improved, but the structural complexity increases making miniaturization more difficult
Solution Approach 1:
The patent combines multiple optical components (lens, beam splitter, mirror, filter) into a single integrated optical element with multiple optical films formed on opposite surfaces of one substrate. This merging approach maintains diverse optical functionality while reducing the number of separate components and simplifying the overall structure.
Solution Approach 2:
The optical element is designed as a multi-functional component where a single substrate supports multiple optical films that perform different optical functions simultaneously. This universal design allows one component to replace multiple specialized components, enhancing functionality without proportionally increasing complexity.
2Device complexity
If multiple optical components are integrated into a single element, then the integration degree is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The optical element divides multiple optical functions into separate optical films formed on opposite surfaces of the substrate. This segmentation allows each optical film to be manufactured and optimized independently, reducing the overall manufacturing precision requirements compared to creating a single complex multi-functional film.
Solution Approach 2:
The substrate acts as an intermediary that supports and separates multiple optical films, allowing them to be manufactured independently at different times and by different processes. This mediator approach enables modular manufacturing where each optical film can be optimized separately, reducing the cumulative precision requirements.
Data Source
AI summary
An optical element including a first substrate, a second substrate, a first optical film, a second optical film, and a spacer is provided. The first optical film is disposed on the first substrate and has a first surface and a plurality of first optical microstructures. The first optical microstructures are disposed on the first surface. The second optical film is disposed on the second substrate and has a second surface and a plurality of second optical microstructures. The second surface is opposite to the first surface. The second optical microstructures are disposed on the second surface. The orthogonal projection of the first optical microstructures on the first substrate does not overlap with the orthogonal projection of the second optical microstructures on the first substrate. The spacer is disposed between the first substrate and the second substrate. A wafer level optical module adopting the optical element is also provided.