Dual-Sided Wafer Optical Processing for Fast Post-Sinter Recovery
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Solution Overview
Problem
Current PERC solar cell production processes require prolonged periods for wafer light attenuation and recovery after sintering, necessitating pipelining to increase efficiency, which is inefficient.
Innovation Solution
A wafer optical processing device with upper and lower light source devices, supported by a conveyor belt, simultaneously processes the front and rear faces of wafers using LED light sources, enhanced by cooling and airflow systems to manage heat and foreign substances, integrated into a sintering furnace.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If natural light attenuation and recovery process is used after sintering, then the wafer processing is simple, but the processing time is prolonged
Solution Approach 1:
The patent applies dimensionality change by introducing both upper and lower light source devices to illuminate the wafer from two directions simultaneously. This dual-directional optical processing approach accelerates the light attenuation and recovery process from minutes to 10-30 seconds, effectively resolving the time loss issue while maintaining reasonable device complexity through the use of standard LED light sources and conveyor belt integration
2Productivity
If pipelining processing is adopted to increase production efficiency, then more wafers can be processed, but the overall system complexity increases
Solution Approach 1:
The patent implements continuous useful action through the conveyor belt system that continuously transports wafers through the optical processing zone. The upper and lower light sources operate continuously during wafer passage, eliminating idle time between processing steps. This continuous processing approach increases productivity without requiring complex pipelining architectures, as the entire optical processing operation occurs in a single continuous pass
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device accelerates the light attenuation and recovery process to 10-30 seconds, significantly enhancing production efficiency by processing both faces concurrently.
Implementation Method 1
an upper light source device, said upper light source device being disposed above said wafer support device and configured to provide a light source that illuminates the upper surface of said support piece; and a lower light source device, said lower light source device being disposed below said wafer support device and configured to provide a light source that illuminates the lower surface of said support piece
Data Source
AI summary
The present application provides a wafer optical processing device and a sintering furnace, said wafer optical processing device comprising: a wafer support device (140a, 140b), an upper light source device (402), and a lower light source device (502). Said wafer support device is provided with a support piece (305), said support piece being configured to be capable of supporting said wafer above said upper surface; said upper light source device is disposed above said wafer support device and is configured to provide a light source that illuminates the upper surface of said support piece; said lower light source device is disposed below said wafer support device and is configured to provide a light source that illuminates a lower surface of said support piece. A wafer optical processing device provided by the present application is capable of processing a wafer efficiently.