Wafer Package Alignment Marks for Precise Stacking After Dicing
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Solution Overview
Problem
Current wafer-level packaging methods face challenges in achieving precise alignment and efficient manufacturing processes, particularly during the stacking and bonding of wafers, which can lead to misalignment and reduced yield in the production of compact package structures.
Innovation Solution
The implementation of alignment mark structures embedded in the dielectric material of semiconductor wafers, which are designed to align vertically and remain intact during the dicing process, allowing for precise wafer-to-wafer alignment and improved pattern fidelity through the use of complementary pattern designs in the alignment mark structures, facilitating better wafer stacking and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wafer-level packaging methods are used to achieve compact package structures, then the package size is reduced and footprint is minimized, but alignment precision deteriorates during wafer stacking and bonding
Solution Approach 1:
Alignment mark structures are formed on the wafer surface before dicing and packaging processes. These marks serve as reference features that guide precise alignment during subsequent wafer stacking and bonding operations, enabling compact package construction without sacrificing alignment accuracy
Solution Approach 2:
Alignment mark structures act as intermediary reference features between different wafers during stacking. These marks provide a common reference framework that mediates the alignment process, allowing precise positioning of multiple wafers relative to each other in compact package configurations
2Productivity
If dicing process is performed to separate individual packages, then package production is enabled, but alignment mark integrity deteriorates
Solution Approach 1:
The wafer is divided into multiple individual packages through dicing, with alignment mark structures strategically positioned to remain intact on each separated package. This segmentation approach enables mass production while preserving alignment references on individual units for subsequent assembly operations
Solution Approach 2:
Alignment mark structures are formed and positioned on the wafer before the dicing process. This preliminary placement ensures that when the wafer is later separated into individual packages, each piece retains its alignment marks, maintaining reliability throughout the production process
3Ease of manufacture
If photolithographic processes are used for pattern formation, then interconnect structures are created, but alignment accuracy deteriorates due to cumulative errors
Solution Approach 1:
Alignment mark structures provide reference feedback for subsequent photolithographic patterning steps. By using these persistent marks as alignment targets, the system can correct for cumulative errors across multiple processing steps, maintaining high alignment accuracy throughout complex interconnect structure fabrication
Solution Approach 2:
Alignment mark structures are formed before photolithographic processes to establish a reference framework. This preliminary action creates stable alignment targets that guide subsequent patterning operations, preventing cumulative alignment errors from degrading manufacturing precision
Data Source
AI summary
A package structure including at least one die laterally encapsulate by an encapsulant, a bonding film and an interconnect structure is provided. The bonding film is located on a first side of the encapsulant, and the bonding film includes a first alignment mark structure. The package structure further includes a semiconductor material block located on the bonding film. The interconnect structure is located on a second side of the encapsulant opposite to the first side, and the interconnect structure includes a second alignment mark structure. A location of the first alignment mark structure vertically aligns with a location of the second alignment mark structure.