Wafer-Level Semiconductor Package With High-Modulus Dielectric RDL
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Solution Overview
Problem
The challenge of integrating multiple semiconductor devices in a single semiconductor wafer for miniaturization, higher speed, and better electrical performance, particularly in areas like cell phones and high-performance computing, is not adequately addressed by existing packaging and assembling techniques.
Innovation Solution
A semiconductor package manufacturing process involving wafer-level packaging, where semiconductor dies are processed on a carrier with encapsulating materials, seed layers, and dielectric layers to form a redistribution structure with conductive traces and terminals, allowing for efficient electrical connections and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If multiple semiconductor devices are integrated on a single wafer, then miniaturization and integration density are improved, but transmission loss and insertion loss increase
Solution Approach 1:
The patent transitions from planar 2D wafer integration to 3D vertical stacking architecture. Multiple semiconductor dies are stacked in the vertical dimension and interconnected through through-silicon vias (TSVs), enabling high integration density while maintaining short signal paths that reduce transmission loss despite the increased number of devices.
Solution Approach 2:
The patent implements nested packaging structures where semiconductor dies are stacked within an encapsulant, with redistribution layers and interconnection structures nested between layers. This nested arrangement achieves compact integration while maintaining efficient electrical connections that minimize insertion loss.
2Productivity
If wafer-level packaging is used, then manufacturing efficiency and productivity are improved, but mechanical stability and reliability become more challenging
Solution Approach 1:
The patent combines multiple semiconductor dies, encapsulant, redistribution layers, and interconnection structures into a single integrated wafer-level package. This merging approach maintains mechanical stability through unified structural design while enabling high-volume manufacturing through wafer-level processing techniques.
Solution Approach 2:
The patent employs composite material structures including encapsulant materials that provide mechanical protection, multiple dielectric layers for electrical isolation, and conductive interconnection materials. This composite architecture ensures both mechanical reliability and electrical performance in wafer-level packages.
Data Source
AI summary
A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The first material is different from the second material, the first material includes a first organic resin with first inorganic fillers, and the second material includes a second resin with second inorganic fillers.