Wafer Package Thermal Layer Layout for Chip Heat Dissipation
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Solution Overview
Problem
Existing chip package devices face inefficiencies in heat dissipation, leading to excessive internal temperatures and reduced lifespan due to inadequate thermal management as power consumption increases.
Innovation Solution
Incorporation of a thermally conductive layer, comprising a metal layer and a thermally conductive adhesive or metal columns, between the chip and the substrate to create efficient heat dissipation passages, with varying metal column densities based on heat generation areas to optimize heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power consumption of the chip is increased to meet higher performance requirements, then processing capability is improved, but heat generation increases leading to excessive internal temperature
Solution Approach 1:
A thermally conductive layer is introduced as an intermediary between the chip and the substrate. This layer serves as a heat transfer mediator, conducting heat away from the chip to the substrate for dissipation, thereby resolving the temperature issue while allowing continued high power operation
Solution Approach 2:
The heat generated by the chip is extracted and separated from the chip structure by introducing a dedicated thermally conductive layer. This layer specifically handles the heat removal function, allowing the chip to operate at higher powers without temperature buildup
2Temperature
If a thermally conductive layer is added between the chip and substrate to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The thermally conductive layer is designed to serve multiple functions: it provides thermal conduction for heat dissipation while also serving as an adhesive layer for mechanical bonding between the chip and substrate. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat generated by the chip, maintaining normal working temperatures and extending the chip's lifespan by establishing efficient heat transfer paths through the thermally conductive layers and substrates.
Implementation Method 1
a thermally conductive layer 26 disposed between the chip 21 and the second substrate 23, and the thermally conductive layer 26 is configured to dissipate, through the second substrate 23, heat generated by the chip 21
Data Source
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AI summary
A chip package device is provided. The chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate; the chip is electrically connected to the first substrate through a first conductive part; the first substrate is electrically connected to the second substrate through a second conductive part; and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device further includes a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate, so that the chip maintains a normal temperature.