Wafer Packaging Structure With Liquid Cooling and Reinforcement
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Solution Overview
Problem
Current flip-chip packaging technologies face challenges in integrating multiple chips into a single platform while effectively managing the increased heat generated due to higher computing demands, as the standard organic substrates lack sufficient heat dissipation capacity.
Innovation Solution
A wafer packaging system is developed, featuring a silicon substrate with a rewiring layer and a structural reinforcement layer that includes liquid cooling channels, enhancing both structural rigidity and heat dissipation capabilities by integrating multiple chips onto a full-wafer-size platform.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple chips are integrated onto a larger platform to increase computing power, then the computing capability is improved, but the heat generated during operation increases
Solution Approach 1:
The patent segments the heat dissipation function from the structural support function by introducing a dedicated thermal management layer with liquid cooling channels, allowing the platform to handle higher computing power without proportional heat accumulation
Solution Approach 2:
The patent introduces liquid cooling channels as an intermediary thermal management system between the chips and the environment, using fluid circulation to transfer heat away from the integrated chips, thus enabling higher computing power without excessive temperature rise
2Adaptability or versatility
If the substrate dimensions are increased to accommodate more chips, then the integration capacity is improved, but the structural rigidity deteriorates
Solution Approach 1:
The patent employs a composite structure combining organic substrate with additional reinforcement layers, creating a multi-material platform that maintains structural rigidity while supporting larger dimensions for increased chip integration capacity
Solution Approach 2:
The patent addresses the rigidity issue by adding vertical reinforcement through multiple layered structures and support elements, transitioning from a two-dimensional substrate to a three-dimensional composite platform that maintains stiffness at larger dimensions
3Reliability
If organic substrate is used for chip integration, then the packaging performance is improved, but the heat dissipation capacity is insufficient
Solution Approach 1:
The patent merges the structural support function of the organic substrate with a dedicated thermal management system featuring liquid cooling channels, creating an integrated platform that simultaneously provides both packaging reliability and adequate heat dissipation capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively supports a larger silicon substrate platform, providing improved structural rigidity and enhanced heat dissipation through the thermal conducting path created by the structural reinforcement layer and liquid cooling channels, addressing the limitations of existing technologies.
Implementation Method 1
The structural reinforcement layer, along with liquid cooling channels, also provides a thermal conducting path for heat generated during the operation of the system
Data Source
AI summary
A wafer packaging system and a method for manufacturing the same are disclosed; the system comprises: a silicon substrate having a first surface and a second surface opposite to the first surface; a rewiring layer disposed on the first surface of the silicon substrate; a plurality of chips bonded over the rewiring layer; and a structural reinforcement layer, fixed to the second surface of the silicon substrate, wherein liquid cooling channels are formed inside the structural reinforcement layer. The wafer packaging system of the present disclosure integrates a plurality of chips with different functions onto one full-wafer-size platform to improve the packaging performance. A structural reinforcement layer is added to the packaging system, which supports a large silicon substrate platform and enhances the structural rigidity of the whole packaging system. The structural reinforcement layer, along with liquid cooling channels, provides a heat conducting path for heat generated by the system.