Wafer Pad Layout With Dummy Connectors for Probe Damage Isolation

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Solution Overview

Problem

Existing wafer structures face challenges in minimizing the area coverage of conductive pads on chips, which can lead to scratches or damages during testing, affecting subsequent manufacturing processes.

Innovation Solution

A wafer structure design featuring conductive pads with separate bonding and probing portions, where the probing portions are connected to dummy connectors, allowing probes to contact only the probing portions, reducing the area coverage and minimizing damage to the bonding portions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the area coverage of conductive pads on chip body is reduced, then more area is available for chip design, but the conductive pads become more susceptible to scratches or damages during testing

Engineering Contradiction:

Improvearea coverage of conductive pads on chip bodyVSAvoidintegrity of conductive pads during testing

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The conductive pad is segmented into two distinct portions: a bonding portion located on the chip body and a probing portion located on the dummy connector. This segmentation allows the bonding portion to remain small (reducing area coverage on chip body) while the probing portion provides a separate contact area for testing, thus resolving the contradiction between minimizing pad area and ensuring testing reliability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dummy connector acts as an intermediary structure that carries the probing portion of the conductive pad. During testing, the probe contacts the probing portion on the dummy connector rather than directly on the chip body, serving as a mediator that protects the bonding portion from damage while enabling testing functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the conductive pads are kept small on chip body, then manufacturing flexibility is improved, but the pads may suffer from scratches or damages during probe testing

Engineering Contradiction:

Improvechip design flexibilityVSAvoidscratches or damages to conductive pads

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

By segmenting the conductive pad into bonding and probing portions located on different structures (chip body and dummy connector respectively), the bonding portion can be minimized for manufacturing flexibility while the probing portion provides adequate area for testing without risking damage to the bonding portion

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The dummy connector serves as an intermediary that absorbs the mechanical stress and potential damage from probe testing, protecting the bonding portion on the chip body from scratches or damages while maintaining ease of manufacture for the chip structure

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS12546801B2Wafer structure comprising multiple chips and dummy connectors including bonding and probing segments

Publication Date: 2026.02.10 NAN YA TECH

AI summary

A wafer structure includes a plurality of chips and a plurality of dummy connectors. The chips are separated from each other. Each of the chips includes a body and a plurality of conductive pads. The conductive pads are respectively and at least partially disposed on the body. The dummy connectors are connected with each other. Each of the dummy connectors is connected between adjacent two of the bodies. Each of the conductive pads is further at least partially disposed on a corresponding one of the dummy connectors.