Rotating Wafer Paddle Transfer for Higher Position Accuracy
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Solution Overview
Problem
Existing wafer carrying apparatuses in semiconductor processing suffer from large position errors and low quality thin film deposition due to excessive movement steps during transfer, leading to reproducibility issues.
Innovation Solution
An automatic wafer carrying system utilizing a vacuum chamber with rotating first and second paddles driven by a double-ferrule magnetofluid and dual drive mechanisms to reduce movement steps and improve position accuracy, featuring a synchronized and opposing rotation mechanism to accurately transfer wafers between stations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wafer carrying apparatuses are used with multiple movement steps, then the wafer can be transferred between stations, but the position error of the wafer increases and transfer accuracy decreases
Solution Approach 1:
The patent combines multiple movement steps into a single transfer operation by using a carrier that can hold multiple wafers and transfer them simultaneously to different stations. The carrier integrates several wafer holding positions and performs coordinated movement to deliver wafers to multiple heating plates in one operation, thereby reducing the total number of movement steps and improving position accuracy.
Solution Approach 2:
The carrier is divided into multiple independent wafer holding positions, each capable of being precisely positioned. This segmentation allows each wafer to be transferred with high precision while the overall system performs multiple transfers in parallel, reducing the cumulative error that would occur in sequential transfers.
2Manufacturing precision
If multiple movement steps are used during wafer transfer, then wafer can be moved between stations, but the quality of thin film deposition decreases
Solution Approach 1:
The system enables continuous wafer transfer operations by loading multiple wafers onto the carrier at one station and transferring them to multiple heating plates in a single coordinated movement. This eliminates idle time between transfers and ensures continuous deposition processes, improving both film quality and efficiency.
3Reliability
If conventional wafer carrying apparatuses are used, then wafer transfer can be performed, but the stability of automatic wafer transfer is reduced
Solution Approach 1:
The system incorporates sensors and control mechanisms that monitor the position and status of wafers during transfer. This feedback enables real-time adjustments to maintain precise positioning and detect any anomalies, thereby improving the stability and reliability of automatic wafer transfer operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances transfer accuracy and stability, resulting in improved uniformity of thin film deposition and increased product qualification rates by minimizing wafer movement and ensuring precise positioning.
Implementation Method 1
a double-ferrule magnetofluid, connected to the vacuum chamber in a sealed manner, and connected to the plurality of first paddles and the plurality of second paddles, to drive the first paddles or the second paddles or both the first and second paddles to rotate
Data Source
AI summary
An automatic wafer carrying system and a method for transferring a wafer using the system are provided. The system includes: a vacuum chamber, including a plurality of wafer carrying stations; a plurality of first paddles and second paddles, all located inside the vacuum chamber and capable of rotating synchronously separately, where each of the plurality of second paddles and a corresponding first paddle form a pair of paddles to carry a wafer jointly; a double-ferrule magnetofluid, connected to the vacuum chamber in a sealed manner, and connected to the plurality of first paddles and the plurality of second paddles, to drive the first paddles or the second paddles or both the first and second paddles to rotate; a first drive mechanism, connected to the double-ferrule magnetofluid, to drive the plurality of first paddles and the plurality of second paddles through the double-ferrule magnetofluid to rotate synchronously in the same direction; and a second drive mechanism, also connected to the double-ferrule magnetofluid, to implement relative rotation of the plurality of first paddles and the plurality of second paddles through the double-ferrule magnetofluid. The system can reduce movement steps of a wafer during transfer, so as to improve transfer accuracy and stability of the wafer and reduce a position error of the wafer.