Semiconductor Wafer Pattern Symmetry to Reduce Cleavage Chipping
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Solution Overview
Problem
The scribing and breaking method for dividing semiconductor wafers can result in chipping, where a part of the chip breaks off during the division process, leading to defects in semiconductor devices.
Innovation Solution
A semiconductor device with a pattern structure having a protruding shape is formed on the semiconductor substrate, where the pattern structure is symmetrical within predetermined distances from the cleavage planes. This configuration ensures a uniform load is applied during the division process, reducing the likelihood of chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the scribing and breaking method is used to divide semiconductor wafers, then the number of semiconductor devices that can be produced from the semiconductor wafer increases and manufacturing cost is reduced, but chipping occurs where a part of the chip breaks off during the division process
Solution Approach 1:
The patent applies preliminary action by forming weakened portions (scribed lines) along the boundaries between adjacent element regions before the dividing process. This pre-weakening allows the semiconductor wafer to cleave cleanly along predetermined paths when pressure is applied, preventing random chipping during division while maintaining high productivity through the scribing and breaking method
2Ease of manufacture
If the scribing and breaking method is used to divide semiconductor wafers, then manufacturing cost is reduced, but chipping occurs where a part of the chip breaks off during the division process
Solution Approach 1:
The patent forms weakened portions along boundaries before division, enabling clean cleavage that prevents chipping. This preliminary structuring allows the use of simple breaking mechanisms rather than complex precision cutting equipment, maintaining low manufacturing cost while improving chip integrity through controlled fracture paths
Solution Approach 2:
The patent modifies the physical state of the semiconductor material along scribe lines by creating weakened portions with different mechanical properties. These modified regions have reduced strength and increased susceptibility to cleavage, allowing the bulk material to remain intact while enabling controlled division at specific locations without chipping
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The symmetrical pattern structure effectively restricts the occurrence of chipping during the division of semiconductor wafers, resulting in higher yields of functional semiconductor devices and reduced manufacturing costs.
Implementation Method 1
the semiconductor wafer is divided by cleaving starting from the weakened portions
Data Source
AI summary
A semiconductor device includes a semiconductor substrate having first and second main surfaces, first and second side surfaces opposite to each other in a first direction, and third and fourth side surfaces opposite to each other in a second direction perpendicular to the first direction, and a pattern structure disposed on the first main surface. The pattern structure within a first predetermined distance from the first side surface along the first direction and the pattern structure within the first predetermined distance from the second side surface along the first direction are symmetrical with respect to a line extending in the second direction. The pattern structure within a second predetermined distance from the third side surface along the second direction and the pattern structure within the second predetermined distance from the fourth side surface along the second direction are symmetrical with respect to a line extending in the first direction.