Wafer Perforating Device with Particle-Aware Depth Control
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Solution Overview
Problem
The existing wafer cutting processes using diamond blades are prone to generating particles, require cooling, and risk damaging patterns on the wafer, while laser cutting with a perforating process faces challenges in accurately determining perforating depths and ignoring or misidentifying particles at the cutting point.
Innovation Solution
A wafer perforating device with a displacement measure module and a laser module that measures and corrects displacement based on particle presence, adjusts perforating depth, and avoids errors by distinguishing between upper and lower particles, ensuring precise perforation without damaging patterns or causing non-separation issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If blade sawing with diamond blade is used for cutting wafer, then cutting process can be performed, but wafer particles are generated and patterns may be damaged
Solution Approach 1:
The patent replaces the mechanical blade sawing system with a laser-based perforation system. The laser module emits laser beams to create perforations at predetermined positions on the wafer, eliminating the need for mechanical contact between the blade and wafer surface. This substitution prevents wafer particles from being generated during the cutting process while avoiding damage to the delicate patterns on the wafer.
2Object-generated harmful factors
If laser cutting with perforating process is used, then particles generation is reduced, but accurate determination of perforating depth becomes difficult due to particle presence
Solution Approach 1:
The patent implements a feedback mechanism where the displacement measurement module continuously monitors the position of the wafer surface at each perforation point. When a particle is detected (indicated by abnormal displacement values), the system automatically corrects the perforating depth by referencing the displacement data from adjacent points. This feedback loop ensures accurate perforation depth determination even in the presence of particles.
Solution Approach 2:
The displacement measurement module performs preliminary measurement of the wafer surface position before laser perforation. By measuring the displacement at each perforation point in advance and storing this data, the system establishes a baseline for determining accurate perforation depth. This preliminary action allows the system to compensate for particle interference during the actual perforation process.
3Manufacturing precision
If displacement measurement is performed at each perforating point, then perforating depth can be determined, but particle presence causes measurement errors
Solution Approach 1:
The displacement measurement module measures the wafer surface position at each perforation point before laser perforation begins. This preliminary measurement establishes the baseline displacement data that is stored and used for subsequent perforation depth calculation. By performing this measurement in advance, the system ensures accurate depth determination while identifying particle presence through abnormal displacement values.
Solution Approach 2:
The system implements a feedback mechanism that compares displacement measurements from adjacent perforation points. When a significant deviation is detected (indicating particle presence), the system automatically corrects the measurement by referencing data from neighboring points. This feedback process maintains measurement reliability and ensures accurate perforation depth even when particles are present on the wafer surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances the precision and reliability of wafer cutting by accurately determining perforating depths and avoiding errors due to particle presence, minimizing pattern damage and non-separation phenomena, thus improving the overall cutting process.
Implementation Method 1
a displacement measure module fixed within the housing and configured to measure a displacement from a surface of the wafer
Implementation Method 2
a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement
Data Source
AI summary
A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at least one of the housing and the chuck stage moves in a first horizontal direction, and the housing and the chuck stage intersect each other on the first direction, a displacement sensor fixed within the housing and configured to measure a displacement with a surface of the wafer at a perforating point spaced apart periodically in the first direction of the wafer and a laser module fixed within the housing and configured to irradiate a laser into a perforating depth determined according to the displacement at the perforating point. The displacement sensor determines whether an upper particle and a lower particle are present at the perforating point by considering a step height of the displacement, and ignores the displacement of the perforating point with the presence of an upper particle.