Wafer Peripheral Tape Application With UV Peeling and Roller Rotation
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Solution Overview
Problem
The challenge of protecting the peripheral portion of larger-diameter wafers during processing, such as in plating processes, is exacerbated by the lifting of protective films, leading to contamination and performance failure, while existing tape sticking and peeling systems face issues with damage to the substrate and adhesive residue.
Innovation Solution
A tape sticking system and method utilizing a substrate holder, side and first/second rollers, and a roller-driving motor to rotate the substrate, combined with UV irradiation for adhesive curing, to minimize substrate damage and facilitate efficient tape peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective film is attached to the back surface of the wafer to prevent plating solution penetration, then the wafer is protected from contamination, but the protective film peels off due to thermal expansion mismatch and adhesive degradation at high temperatures
Solution Approach 1:
The protective coverage is segmented into two separate components: a protective film on the back surface and a protective tape on the peripheral portion. This segmentation allows each component to be optimized for its specific function and environmental conditions, with the protective tape providing thermal and mechanical stability at the edges where temperature gradients are highest.
Solution Approach 2:
Different protective measures are applied to different locations of the wafer. The protective film covers the back surface where chemical protection is needed, while the protective tape with higher heat resistance covers the peripheral portion where thermal stress and adhesion failure are most critical.
2Productivity
If the wafer diameter is increased to meet automotive electrification demands, then larger wafers can be processed, but the peripheral portion becomes more susceptible to protective film lifting and contamination
Solution Approach 1:
The protection strategy extends from the two-dimensional back surface into the third dimension by wrapping the protective tape around the peripheral portion and bevel surfaces. This three-dimensional protection ensures that the peripheral edges, which are most vulnerable in larger wafers, are shielded from plating solution penetration.
3Ease of manufacture
If conventional mechanical peeling methods are used to remove protective tape, then the process is simple, but adhesive residue remains on the wafer surface
Solution Approach 1:
The mechanical peeling process is replaced with UV irradiation to remove the protective tape. The UV light breaks down the adhesive bonds, allowing the tape to be removed without leaving residue on the wafer surface, thereby maintaining surface cleanliness without complex mechanical peeling mechanisms.
4Manufacturing precision
If the wafer is rotated during tape sticking to improve coverage, then uniform adhesive application is achieved, but centrifugal force may damage the wafer structure
Solution Approach 1:
The wafer rotation is implemented as a controlled dynamic process with adjustable speed and duration. The rotation is performed at low speeds sufficient to achieve uniform adhesive distribution but low enough to prevent centrifugal damage to the wafer structure, optimizing both tape placement quality and wafer integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system reduces substrate damage and shortens tape peeling time, preventing adhesive residue by applying rotational force and curing the adhesive with UV rays, ensuring stable processing and high yield.
Implementation Method 1
a UV irradiation module configured to irradiate ultraviolet light to the protective tape stuck on the peripheral portion of the substrate
Data Source
Figure 1A~1B
Figure 2~3
Figure 4
AI summary
The present invention relates to a tape sticking system for sticking a protective tape for protecting a peripheral portion of a substrate, such as a wafer. The tape sticking apparatus (10) includes a substrate holder (21) for sticking, a side roller (43), a first roller (46), a second roller (47), a roller-driving motor (49) coupled to the second roller (47), and a nipping mechanism (60) for nipping the peripheral portion of the substrate (W) with the first roller (46) and the second roller (47). The tape sticking apparatus (10) is configured to cause the second roller (47) to be rotated by use of the roller-driving motor (49) while nipping the peripheral portion of the substrate, held to the substrate holder (21) for sticking, with the first roller (46) and the second roller (47), to thereby rotate the substrate.