Wafer Photolithography Identification for Component Traceability

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Solution Overview

Problem

Existing methods for manufacturing electronic components on semiconductor wafers require additional photolithography steps and manual operations for traceability, leading to increased costs and production time, especially when components are not encapsulated.

Innovation Solution

A method that incorporates an identification mask during photolithography, varying photolithographic parameters like exposure dose and focusing across different field areas to create unique identification marks for each area, eliminating the need for additional photolithography steps and manual tracing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If additional photolithography masks are applied to generate specific patterns for each component, then component traceability is achieved, but manufacturing complexity and production time increase

Engineering Contradiction:

Improvecomponent traceabilityVSAvoidphotolithography process complexity

Core Design Contradiction:

Loss of informationVSDevice complexity

Solution Approach 1:

The patent combines the identification pattern generation with the existing photolithography masks used for manufacturing electronic components. Instead of applying separate additional masks, the identification patterns are integrated into the same mask layers that define the component structures, thereby achieving traceability without increasing process complexity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The photolithography masks serve dual functions: they define both the electronic component structures and the identification patterns simultaneously. This multi-functionality eliminates the need for dedicated traceability masks, reducing manufacturing complexity while maintaining complete component identification capability

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Loss of information

If manual marking operations are performed on packages, then component traceability is achieved, but production time and costs increase

Engineering Contradiction:

Improvecomponent traceabilityVSAvoidproduction speed

Core Design Contradiction:

Loss of informationVSProductivity

Solution Approach 1:

The identification patterns are created during the photolithography process before the components are packaged. This preliminary action eliminates the need for subsequent manual marking operations on finished packages, thereby maintaining traceability while significantly increasing production speed and reducing costs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces manual mechanical marking operations with automated photolithography-based pattern generation. The identification patterns are formed through light exposure and chemical processing rather than physical marking, enabling high-speed automated production while maintaining accurate component traceability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Loss of information

If photolithography parameters are varied across field areas, then unique identification marks are created, but process control complexity increases

Engineering Contradiction:

Improvespatial identificationVSAvoidphotolithography process control

Core Design Contradiction:

Loss of informationVSDevice complexity

Solution Approach 1:

The patent applies different photolithography parameters (such as exposure dose, focus, or wavelength) to different field areas on the wafer. Each field area receives localized parameter adjustments that create unique identification patterns specific to that region, enabling spatial identification while using standard photolithography equipment capabilities

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate identification of component locations on the wafer post-cutting without additional masks, reducing production costs and time, and minimizing human error in mass production.

Implementation Method 1

a photolithography step comprising the application of a mask successively on each field in photolithography equipment... at the photolithography step associated with the identification mask, at least one photolithographic parameter of the photolithography equipment is different for each field area, to expose the identification pattern differently in each field area

Methodology Applied

Scientific EffectPhotolithography: Photopolymerisation

Data Source

PatentUS12538807B2Method for producing an electronic component assembly on the front face of a semi-conductor wafer

Publication Date: 2026.01.27 STMICROELECTRONICS FRANCE

AI summary

The invention concerns a method of manufacturing an assembly of electronic components (3) on the front surface of a semiconductor wafer (1) comprising a plurality of field areas (4), each area (4) comprising at least one field (2) and each field (2) comprising at least one electronic component (3). The method comprises a plurality of photolithography steps to form a stack of layers forming each electronic component (3), each photolithography step comprises the application of a mask successively on each field (2) in photolithography equipment. One of the masks further comprises an identification pattern, said mask being called identification mask. At the photolithography step associated with the identification mask, as least one photolithographic parameter of the photolithography equipment is different for each field area (4), to expose the identification pattern differently in each field area (4).