Wafer Pick-and-Place Robot Collision Prevention
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Solution Overview
Problem
Current wafer pick-and-place methods in batch-type wafer heat treatment systems are prone to collisions and wafer damage due to environmental and mechanical variations, as well as thermal deformation, which can lead to unsafe handling conditions.
Innovation Solution
A wafer pick-and-place method and system that uses a robot with a fork equipped with upper and lower sensor groups to detect distances and tilted angles of wafers, stopping the robot if collision or slipping is likely to prevent damage and ensure safe handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If offline teaching data is used for robot pick-and-place operations, then the robot can perform automated wafer handling, but collision and wafer damage may occur due to environmental variations and thermal deformation
Solution Approach 1:
The patent implements real-time feedback through sensors that continuously monitor wafer position and robot location during pick-and-place operations. The sensor data feeds back to the control system, which dynamically adjusts robot movement parameters to prevent collision and accommodate thermal deformation, thereby maintaining both automation and reliability
Solution Approach 2:
The patent performs preliminary detection of wafer position and robot location before the actual pick-and-place operation. By提前 acquiring positional information through sensors and pre-calculating safe movement paths, the system prevents collision before it occurs while maintaining automated operation
2Measurement precision
If robot positional parameters are calibrated periodically, then the robot can maintain operation accuracy, but thermal deformation of wafers during heat treatment causes offset between actual wafer location and stored robot parameters
Solution Approach 1:
The patent uses sensors to continuously monitor actual wafer position during heat treatment and feeds this information back to the control system. The system dynamically compensates for thermal deformation by adjusting robot positional parameters in real-time based on the detected wafer location, maintaining measurement precision despite temperature changes
Solution Approach 2:
The patent dynamically changes robot positional parameters based on detected wafer position and temperature conditions. Instead of using fixed offline-calibrated parameters, the system adjusts movement coordinates, speed, and acceleration in real-time to account for thermal deformation, maintaining operation accuracy
3Extent of automation
If the robot performs pick-and-place operations based on stored offline teaching data, then automated handling is achieved, but collision may occur due to mechanical deformation of the wafer carrier
Solution Approach 1:
The patent implements real-time feedback monitoring of wafer carrier position and robot location during automated operations. Sensors detect actual carrier deformation and feed this information back to the control system, which dynamically adjusts robot movement to avoid collision while maintaining automated pick-and-place functionality
Solution Approach 2:
The patent performs preliminary detection of wafer carrier position and robot location before automated pick-and-place operations. By提前 acquiring actual positional information and identifying potential collision risks, the system can adjust operation parameters in advance to prevent collision from carrier deformation
Data Source
AI summary
A wafer pick-and-place method and system is provided. During the wafer pick-and-place operation, the distance between the fork of the robot and the target wafer is detected to determine whether the robot will collide with the target wafer. Furthermore, the tilted angle of the target wafer relative to the fork is calculated to determine whether the wafer will slip off. If collision or wafer slippery may occur, the pick-and-place operation is stopped. Therefore, wafer damages due to unexpected contact between the fork and the wafer can be avoided, and wafer handling safety can be improved.