Wafer Support Pin Lifting Linkage for Stable Tilted Transfer

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Solution Overview

Problem

Conventional lifting devices for wafer support pins in semiconductor processing cavities face challenges in maintaining wafer stability during transfer, as they often result in airflow disturbances or slippage due to uneven support pin heights and tilting, which can lead to positional shifting if the devices malfunction.

Innovation Solution

A wafer support pin lifting device comprising a support plate, a slide block, and a lifting pole with an actuator, allowing the support plate to pivot between horizontal and tilted positions, ensuring consistent wafer contact with the carrier plate and minimizing airflow disturbances during transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If support pins are kept at equal height during wafer transfer, then wafer stability is improved, but airflow disturbances occur when cavity contains gas causing wafer shifting

Engineering Contradiction:
Improvewafer stabilityVSAvoidairflow disturbances
Core Design Contradiction:
Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The support pins are designed with dynamic height adjustment capability through the lifting device. The pins can transition from equal height configuration during transfer to controlled tilting configuration during placement, allowing the system to adapt to different operational phases and eliminate airflow disturbances caused by static equal-height positioning

Inventive Principle:
Principle #15Dynamics

2Stability of the object's composition

If support pins are kept at equal height, then wafer transfer stability is improved, but wafer slippage occurs when vacuum suction force exists during lifting

Engineering Contradiction:
Improvewafer transfer stabilityVSAvoidwafer grip reliability
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The lifting device dynamically adjusts support pin heights during the wafer lifting process. By creating a controlled tilting motion rather than uniform vertical movement, the system reduces vacuum suction forces that cause slippage, while maintaining sufficient stability for reliable wafer transfer

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If multiple independent lifting devices are used to control support pins, then wafer tilting control is improved, but device complexity increases

Engineering Contradiction:
Improvewafer tilting controlVSAvoidlifting device complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple support pins are grouped and connected through a common lifting device structure. The lifting device uses a integrated mechanism with linkages that can control the height of multiple pins simultaneously or independently through a single actuator, reducing the number of separate lifting devices needed while maintaining wafer tilting control capability

Inventive Principle:
Principle #5Merging (Combining)

4Ease of operation

If conventional lifting devices are used, then wafer transfer is simplified, but positional shifting occurs when lifting devices malfunction

Engineering Contradiction:
Improvewafer transfer simplicityVSAvoidwafer position accuracy
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The lifting device controls support pins in groups or segments rather than as a single unit. This segmentation allows independent control of different pin subsets, so that if one lifting mechanism malfunctions, other segments can still maintain wafer position accuracy through coordinated operation of the remaining functional pins

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device maintains wafer stability by allowing controlled tilting of support pins, preventing slippage and shifting, and ensuring smooth transfer operations by maintaining consistent contact with the carrier plate, even in the presence of slight vacuum suction or airflow.

Implementation Method 1

a slide block, slidably connected to an inner wall of the cavity so that the slide block slides relative to the cavity

Methodology Applied
Scientific EffectFriction: Friction

Implementation Method 2

the second end is pivotally connected to the slide block, and the third end is connected to an actuator, wherein the actuator is for controlling the lifting pole to ascend and descend

Methodology Applied
Scientific EffectMechanical Advantage: Mechanical Advantage

Data Source

PatentUS11990363B2Wafer support pin lifting device
Publication Date: 2024.05.21 PIOTECH CO LTD
  • US11990363B2 patent drawing
  • US11990363B2 patent drawing
  • US11990363B2 patent drawing

AI summary

A wafer support pin lifting device includes a support plate, a slide block and a lifting pole. The support plate is for supporting multiple support pins. The slide block is slidably connected to an inner wall of a cavity so that the slide block slides relative to the cavity. The lifting pole has a first end, a second end and a third end. The first end is connected to the support plate, the second end is pivotally connected to the slide block, and the third end is connected to an actuator. With the pivotal connection between the second end of the lifting pole and the slide block, the lifting pole approaching the high position causes the support plate to be approximately horizontal, and the lifting pole approaching the low position causes the support plate to be tilted.