Wafer Placement Table Transverse Conductor Thermal Uniformity
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Solution Overview
Problem
The use of metal mesh bent in a zigzag pattern or vertically placed coils as conductor units in wafer placement tables can lead to increased heat generation, affecting thermal uniformity of wafers.
Innovation Solution
A transversely placed coil or perforated cylindrical body is used as the conductor unit, reducing the conductive path length and improving thermal uniformity by minimizing heat generation, while also increasing the strength and density uniformity of the ceramic substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal mesh bent in a zigzag pattern or vertically placed coil is used as conductor unit, then electrical continuity between first and second conductive layers is established, but conductive path length becomes considerably greater than distance between layers, causing increased heat generation and degraded thermal uniformity
Solution Approach 1:
The conductor unit transitions from a vertical arrangement (zigzag or vertically placed coil) to a horizontal/transverse arrangement. This dimensional change allows the conductor to span the distance between first and second conductive layers laterally rather than vertically, significantly reducing the conductive path length and associated heat generation while maintaining electrical continuity.
2Reliability
If conductor unit with longer conductive path is used, then electrical continuity is ensured, but heat generation increases producing adverse effects on wafer thermal uniformity
Solution Approach 1:
The conductor unit is reconfigured from a vertical path to a horizontal/transverse path between the conductive layers. This dimensional reconfiguration shortens the conductive path length, thereby reducing resistive heat generation (I²R losses) while preserving the essential electrical continuity function.
3Temperature
If transversely placed coil or perforated cylindrical body is used as conductor unit, then conductive path length is reduced closer to distance between conductive layers, but structural strength and density uniformity of ceramic substrate must be maintained
Solution Approach 1:
The conductor unit employs a perforated cylindrical body structure with holes or porous features. This allows ceramic substrate material to penetrate through the conductor during manufacturing, creating mechanical interlocking that strengthens the ceramic substrate while the transverse geometry maintains short conductive path length for thermal uniformity.
Solution Approach 2:
The conductor unit integrates with the ceramic substrate through material interpenetration, creating a composite structure. The conductor provides electrical continuity while the ceramic material filling the perforations provides structural strength and thermal management, achieving both thermal uniformity and mechanical integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses heat generation at the conductor unit, enhancing thermal uniformity of the wafer and increasing the strength of the ceramic substrate, ensuring better electrical continuity and process stability during semiconductor processing.
Implementation Method 1
the conductor unit establishes electrical continuity between the first conductive layer and the second conductive layer
Implementation Method 2
a conductive path of the conductor unit is closer to the distance between the first conductive layer and the second conductive layer than that in the case where the metal mesh bent in a zigzag pattern or the vertically placed coil is used as the conductor unit. Accordingly, heat generation at the conductor unit can be suppressed
Data Source
AI summary
A wafer placement table includes a conductor unit. In the wafer placement table, a sub-RF electrode (first conductive layer) and a jumper layer (second conductive layer) are embedded at different levels in a ceramic substrate having a wafer placement surface, and the conductor unit establishes electrical continuity between the sub-RF electrode and the jumper layer. The conductor unit is a transversely placed coil or a transversely placed perforated cylindrical body.