Wafer Pod Transfer Assembly With Tilt Locking Against Vibration
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Solution Overview
Problem
Semiconductor wafers are prone to mispositioning and breakage during transportation within wafer processing devices due to vibrations, leading to increased costs and reduced yield in semiconductor device manufacturing.
Innovation Solution
A wafer pod transfer assembly with a tilt assembly that tilts the wafer pod upwardly and rearwardly, combined with a pin locking mechanism to secure the shaft and prevent leaning, ensuring stable and secure positioning and movement of wafers, thereby reducing mispositioning and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafers are transported horizontally without tilting, then the transportation path is simple and direct, but wafers are prone to mispositioning and breakage due to vibrations
Solution Approach 1:
The wafer pod transfer assembly incorporates a tilt assembly that dynamically adjusts the transportation path from horizontal to upwardly and rearwardly inclined. This dynamic adjustment allows the system to adapt to different transportation phases, providing vibration mitigation during critical periods while maintaining simple horizontal transport during loading and unloading operations
Solution Approach 2:
The tilt assembly is configured to tilt the wafer pod upwardly and rearwardly before vibrations occur during transportation. This preliminary anti-action creates a downward force component that counteracts upward vibrations, preventing wafer mispositioning and breakage before they can occur
2Reliability
If a tilt assembly is added to mitigate vibrations, then wafer mispositioning and breakage are reduced, but the device complexity and potential sources of failure increase
Solution Approach 1:
The tilt assembly is merged with the wafer pod transfer assembly, sharing common components such as the shaft, shaft receiver, and drive mechanism. This integration eliminates the need for separate tilt control systems, reducing overall device complexity while maintaining the vibration mitigation function
Solution Approach 2:
The shaft and shaft receiver components serve dual functions: they enable both the tilting motion and the horizontal transfer motion. This multi-functionality reduces the number of separate components needed, simplifying the overall device structure while providing the necessary tilt capability
3Manufacturing precision
If a pin locking mechanism is used to secure the shaft, then shaft leaning and wafer mispositioning are prevented, but the device complexity and number of components increase
Solution Approach 1:
The pin locking mechanism is designed to be self-securing, where the pin automatically locks the shaft in the shaft receiver at predetermined positions during rotation. This self-service feature eliminates the need for additional active locking controls or sensors, reducing device complexity while maintaining precise shaft positioning
Solution Approach 2:
The pin is pre-positioned to engage with the shaft at critical points during rotation, preventing shaft leaning before it can occur. This preliminary action ensures that the shaft maintains precise positioning throughout the tilting and transfer operations without requiring continuous active control
Data Source
AI summary
A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.