Wafer Position Correction Using Transparent Scale Plate
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Solution Overview
Problem
Current methods for adjusting the position of a wafer in semiconductor manufacturing machines rely on blind adjustment, leading to inaccurate positioning, which affects the thickness, uniformity, and particle quantity of film layers, resulting in low product yield.
Innovation Solution
A tool and method utilizing a cover plate, transparent plate, first and second scales with scale lines, and magnifying glass components to accurately measure and adjust the gap between the wafer and the wafer bearing apparatus, ensuring precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If blind adjustment is used to adjust wafer position, then the adjustment process is simple, but the positioning accuracy is poor
Solution Approach 1:
A transparent plate with scales is introduced as an intermediary tool between the operator and the wafer positioning process. The transparent plate allows direct visual measurement of the gap between wafer and chamber wall, serving as a mediator that translates invisible positioning errors into visible, measurable quantities that can be accurately assessed and corrected
Solution Approach 2:
The patent replaces blind mechanical adjustment with optical measurement. By using a transparent plate with visual scales, the system substitutes tactile/mechanical guessing with optical visualization, allowing operators to see and measure the actual gap dimensions rather than relying on feel or estimation
2Ease of operation
If blind adjustment is used to adjust wafer position, then the adjustment method is simple, but the time consumption is high
Solution Approach 1:
The transparent plate with pre-marked scale lines is prepared in advance and installed on the chamber. This preliminary setup provides a ready-to-use measurement reference system that eliminates the need for iterative trial-and-error adjustments, allowing direct measurement and single-step correction of wafer positioning
Solution Approach 2:
The transparent plate acts as a mediator that provides immediate visual feedback on positioning accuracy. By making the gap measurement visible through the transparent plate, operators can determine the exact adjustment needed in one observation rather than spending multiple cycles guessing and checking
3Device complexity
If blind adjustment is used to adjust wafer position, then no special equipment is needed, but the film layer quality is poor
Solution Approach 1:
A transparent plate with visual scales is introduced as a simple intermediary measurement tool. This low-complexity device provides accurate visual reference lines that enable precise gap measurement without requiring complex electronic sensors or automated positioning systems, yet still achieves the manufacturing precision needed for quality film layers
Solution Approach 2:
The transparent plate utilizes visual/optical properties to indicate positioning. The scale lines on the transparent plate provide visual references that change apparent position based on the gap size, allowing operators to visually detect and correct positioning errors that directly affect film layer quality
4Ease of operation
If blind adjustment is used to adjust wafer position, then the process is straightforward, but the product yield is low
Solution Approach 1:
The transparent plate with scales serves as a mediator that provides immediate visual information about positioning accuracy. This simple visual feedback mechanism enables operators to make precise adjustments that ensure wafer positioning meets specifications, directly improving product yield while keeping the adjustment process straightforward
Solution Approach 2:
The transparent plate provides visual feedback on the gap between wafer and chamber wall. By making the positioning error visible through the scale lines, the system creates a feedback loop where operators can observe the current state, compare it against specifications, and make corrective adjustments to achieve acceptable positioning and maintain high product yield
Data Source
AI summary
The present disclosure relates to a tool and method for correcting a position of a wafer in a semiconductor manufacturing machine, including: a cover plate, disposed on one side that is of the chamber away from the wafer bearing apparatus, the cover plate is provided with a mounting hole; a transparent plate, installed in the mounting hole, a projection of the wafer bearing apparatus on the transparent plate is located in the transparent plate; and a first scale and a second scale, disposed on the transparent plate, the first scale extends to edges of the transparent plate along a first direction and a direction away from the first direction, the second scale extends to edges of the transparent plate along a second direction and a direction away from the second direction, and the first scale and the second scale are provided with a plurality of uniformly distributed scale lines.