Wafer Inspection Positioning Structure for Direct Optical Detection
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Solution Overview
Problem
Existing wafer inspection methods using transparent carriers distort light signals from flip chip dies due to refraction, scattering, or absorption, leading to unstable inspections.
Innovation Solution
A positioning type wafer inspection device that stabilizes the wafer without a transparent carrier by using a wafer fixing platform with a positioning structure, a horizontal moving base, a probe module, and a die position holder to maintain the wafer's position during inspection, allowing direct optical parameter acquisition from the flip chip dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a transparent carrier is used to support and stabilize the wafer, then the wafer can be maintained in position during inspection, but the light signal from the flip chip dies is refracted, scattered or absorbed causing signal distortion
Solution Approach 1:
The patent removes the transparent carrier from the inspection system entirely. Instead of using a carrier to hold the wafer, the invention uses a positioning structure with an opening that directly supports the wafer without introducing additional optical paths. This extraction of the problematic carrier component eliminates the refraction, scattering, and absorption that caused signal distortion while maintaining wafer stability through alternative positioning mechanisms.
Solution Approach 2:
The patent introduces a positioning structure as an intermediary between the wafer and the inspection system. This positioning structure, with its opening, serves as a mediator that holds the wafer in place without blocking or distorting the light path. The positioning structure acts as a mechanical support that does not interfere optically, replacing the transparent carrier's function while eliminating its harmful effects.
2Reliability
If a transparent carrier is used to support the wafer, then the wafer can be inspected, but the inspection stability is reduced due to signal distortion
Solution Approach 1:
By removing the transparent carrier from the system, the patent eliminates the source of signal distortion that compromised inspection stability. The positioning structure with its opening provides a alternative support mechanism that does not interfere with optical signals, thereby restoring inspection stability and reliability.
Solution Approach 2:
The patent replaces the optical path through a transparent carrier with a direct mechanical positioning system. The positioning structure with its opening provides mechanical support for the wafer without requiring light to pass through additional media, substituting the optical-mechanical interaction with a purely mechanical positioning approach that ensures inspection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device stabilizes the wafer during inspection, preventing signal distortion and enhancing inspection stability by allowing direct optical parameter acquisition without the interference of a transparent carrier.
Implementation Method 1
The die position holder is used to apply a holding force to the wafer along the stopping direction
Implementation Method 2
The probe module is used to electrically contact the electrode portion of the to-be-detected die along the contact direction
Implementation Method 3
the light signal generated by the light-emitting portion of the flip chip dies to be detected penetrates the transparent carrier below
Data Source
AI summary
A positioning type wafer inspection device includes a wafer fixing platform, a horizontal moving base, a probe module, a die position holder, and a detection parameter acquisition module. The wafer fixing platform features a positioning structure designed to keep a wafer within a detection position range and expose the wafer through an opening. The horizontal moving base is used to move the wafer fixing platform on a horizontal plane. The probe module is movably positioned on one side of the wafer along a contact direction. The die position holder is movably positioned on the opposite side of the wafer along a stopping direction. The detection parameter acquisition module is positioned on the side of the wafer opposite the probe module to acquire optical detection parameters.