Wafer Sample Pre-Processing Automation for Alignment and Water Control
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Solution Overview
Problem
Existing semiconductor wafer sample manufacturing processes lack automation, leading to reduced productivity and reliability due to issues such as water scattering, alignment errors, and loss of samples during processing.
Innovation Solution
An automated semiconductor wafer sample pre-processing system that includes a ring frame loading unit, wafer cutting unit, alignment unit, grinding unit, and polishing unit, featuring improvements like drainage channels, level adjustment bolts, high-resolution cameras, stable suction pads, independent water lines, and secure wheel couplings to enhance process automation and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual processes are used for wafer sample manufacturing, then flexibility in operation is maintained, but productivity is reduced and process reliability deteriorates due to alignment errors and sample loss
Solution Approach 1:
The system is divided into distinct functional modules: a ring frame loading unit for loading wafers, a cutting unit for dicing wafers into samples, an alignment unit for positioning samples, and a polishing unit for finishing. Each module performs a specific task in the manufacturing sequence, enabling automated processing while maintaining manageable system complexity through functional segmentation.
2Productivity
If water is supplied to grinding and polishing units simultaneously, then both operations can proceed, but foreign substances scatter and equipment reliability deteriorates
Solution Approach 1:
The water supply system operates periodically rather than continuously for both units. The control unit alternates water supply between the grinding unit and polishing unit based on operational timing, ensuring water is provided when needed for each operation while preventing simultaneous water flow that would cause scattering and reliability issues.
3Reliability
If alignment precision is increased to prevent sample loss, then sample retention improves, but alignment unit complexity increases
Solution Approach 1:
The alignment unit replaces complex mechanical adjustment mechanisms with a camera-based optical detection system. The camera captures images of wafer samples, and the control unit processes these images to automatically determine sample positions and adjust alignment, achieving high precision while reducing mechanical complexity.
4Manufacturing precision
If the ring frame plate is made stable and level, then cutting precision improves, but the structure becomes more complex with additional adjustment mechanisms
Solution Approach 1:
The ring frame plate includes pre-installed level adjustment bolts that allow for preliminary leveling and positioning adjustments before the cutting operation begins. This preliminary adjustment capability ensures the plate is properly leveled for precise cutting without requiring complex real-time adjustment mechanisms during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances productivity, prevents foreign substance scattering, reduces sample loss, improves alignment accuracy, and ensures reliable equipment operation by automating the entire process.
Implementation Method 1
an adsorption unit including an adsorption pad for adsorbing the cut wafer sample, and at least one surface of the adsorption pad is a suction pad
Data Source
AI summary
A semiconductor wafer sample pre-processing system improves productivity and process reliability by automating all process from cutting a into a plurality of wafer samples through polishing of the wafer samples.