Wafer Pre-Wetting Holder Channels for Bubble-Free Copper Plating

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Solution Overview

Problem

The copper electroplating process in semiconductor manufacturing often results in defects due to nano-bubbles trapped in the electroplated copper layer, which limits the quality of conductive features and reduces production yield.

Innovation Solution

A pre-wetting process is employed to enhance the wetting ability of the seed material layer, using controlled fluid delivery methods to prevent bubble formation, followed by electrochemical plating to form a conductive material layer without defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If copper electroplating is performed directly on the seed material layer, then the conductive feature can be formed quickly, but nano-bubbles are trapped in the electroplated copper layer causing defects

Engineering Contradiction:

Improveelectroplating speedVSAvoidconductive feature quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

A pre-wetting process is performed before electroplating to enhance the wetting ability of the seed material layer. This preliminary action prevents bubble formation during subsequent electroplating by ensuring proper fluid penetration and adhesion, thereby eliminating defects without sacrificing plating speed

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If conventional electroplating is used, then the process is simple and fast, but the production yield is reduced due to trapped nano-bubbles

Engineering Contradiction:

Improveprocess simplicityVSAvoidproduction yield

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The pre-wetting step is integrated into the electroplating process flow, performing a preliminary wetting enhancement before plating begins. This simple additional step prevents bubble entrapment and improves production yield while maintaining process simplicity and electroplating speed

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The pre-wetting process effectively prevents bubble formation, ensuring defect-free conductive features and improving the electrical performance of semiconductor devices.

Implementation Method 1

A pre-wetting process is employed to enhance the wetting ability of the seed material layer, using controlled fluid delivery methods to prevent bubble formation

Methodology Applied

Scientific EffectWetting: Wetting

Implementation Method 2

followed by electrochemical plating to form a conductive material layer without defects

Methodology Applied

Scientific EffectElectrochemical plating: Electrodeposition

Data Source

PatentUS20250305176A1Apparatus and method for wafer pre-wetting

Publication Date: 2025.10.02 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor apparatus includes a process chamber, a workpiece holder and a pre-wetting fluid tank. The workpiece holder is disposed within the process chamber to hold a semiconductor workpiece. The pre-wetting fluid tank is disposed outside the process chamber, wherein the workpiece holder comprises an inner sidewall, an outer sidewall and a channel between the inner sidewall and the outer sidewall, the channel is coupled to the pre-wetting fluid tank, and the outer sidewall is higher than the inner sidewall relative to a major surface of the semiconductor workpiece.