Wafer Probe Card Elastic Force Absorption
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Solution Overview
Problem
Existing film probe cards for integrated circuit testing are rendered ineffective and costly if any probe becomes worn or detached, leading to lower test efficiency and higher maintenance costs.
Innovation Solution
A wafer testing probe card design featuring a printed circuit board, flexible circuit board, and elastic piece with probes that pass through holes in the probe head, allowing for individual probe replacement and absorption of reaction forces, enabling shorter probe lengths and increased measurable frequency without deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional film probe cards are used, then testing accuracy is improved, but if any probe is worn or detached, the whole probe card becomes unusable resulting in higher costs and lower efficiency
Solution Approach 1:
The probe card is divided into modular probe units that can be independently replaced. Each probe unit contains a probe head with multiple probes, and when probes are worn or detached, only the specific probe unit needs to be replaced rather than the entire probe card, thereby maintaining testing accuracy while improving test efficiency and reducing costs.
2Adaptability or versatility
If probes are made longer to increase flexibility, then adaptability is improved, but probe length increases leading to slower transmission and lower measurable frequency
Solution Approach 1:
The probe card system is segmented into a rigid probe head portion and a flexible circuit board portion. The probes are mounted on the rigid probe head with optimized shorter lengths for fast transmission, while the flexible circuit board provides the necessary flexibility and adaptability for different testing scenarios, thus achieving both high speed and adaptability.
Solution Approach 2:
The flexible circuit board is positioned between the probe head and the printed circuit board, creating a multi-dimensional structure. This allows the probes to be short and rigid for high-frequency transmission, while the flexible circuit board in the intermediate dimension provides the required flexibility and adaptability for various testing configurations.
3Reliability
If the elastic piece is made thicker to absorb more reaction forces, then reliability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The elastic piece is designed with non-uniform thickness, being thicker at the center where reaction forces are most concentrated and thinner toward the edges. This localized quality distribution optimizes force absorption capability where needed most, while reducing unnecessary material and structural complexity in areas with lower stress concentrations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for easy maintenance and cost reduction by replacing only damaged probes, while the elastic piece absorbs reaction forces, enabling higher frequency measurements and improved test efficiency.
Implementation Method 1
an elastic piece (130), and a probe unit (140). The flexible circuit board (120) is electrically connected to the printed circuit board (110). The elastic piece (130) is disposed between the printed circuit board (110) and the flexible circuit board (120)
Data Source
AI summary
A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.